Patents by Inventor Robert Gleixner

Robert Gleixner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8036016
    Abstract: Subject matter disclosed herein relates to enhancing an operational lifespan of non-volatile memory.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: October 11, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Joy Sarker, Robert Gleixner
  • Publication number: 20110051507
    Abstract: Subject matter disclosed herein relates to enhancing an operational lifespan of non-volatile memory.
    Type: Application
    Filed: September 1, 2009
    Publication date: March 3, 2011
    Inventors: Joy Sarkar, Robert Gleixner
  • Publication number: 20050079651
    Abstract: A wirebond structure includes a copper pad formed on or in a surface of a microelectronic die. A conductive layer is included in contact with the copper pad and a bond wire is bonded to the conductive layer. The conductive layer is formed of a material to provide a stable contact between the bond wire and the copper pad in at least one of an oxidizing environment and an environment with temperatures up to at least about 350° C.
    Type: Application
    Filed: December 1, 2004
    Publication date: April 14, 2005
    Inventors: Robert Gleixner, Donald Danielson, Patrick Paluda, Rajan Naik