Patents by Inventor Robert Goh

Robert Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WDM add/drop multiplexer module
    Patent number: 6822860
    Abstract: A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: November 23, 2004
    Assignee: Redfern Broadband Networks Inc.
    Inventors: Mark J. Owens, Chia Seiler, Brian Robert Brown, Mark Henry Bonwick, Quentin Scott, Robert Goh, Ross Halgren
  • WDM add/drop multiplexer module
    Patent number: 6804116
    Abstract: A chassis member for carrying at least one circuit board for use in a WDM add/drop multiplexer unit, wherein the chassis member is adapted, in use, to function as a heatsink for a heat generating component mounted on the circuit board.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: October 12, 2004
    Assignee: Redfern Broadband Networks Inc.
    Inventors: Mark J. Owens, Chia Seiler, Brian Robert Brown, Mark Henry Bonwick, Quentin Scott, Robert Goh, Ross Halgren
  • WDM add/drop multiplexer module
    Patent number: 6795316
    Abstract: A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for maintaining a controlled temperature environment inside of the component.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 21, 2004
    Assignee: Redfern Broadband Networks, Inc.
    Inventors: Mark J. Owens, Chia Seiler, Brian Robert Brown, Mark Henry Bonwick, Quentin Scott, Robert Goh, Ross Halgren
  • WDM add/drop multiplexer module
    Publication number: 20030169566
    Abstract: A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component.
    Type: Application
    Filed: December 18, 2002
    Publication date: September 11, 2003
    Inventors: Mark J. Owens, Chia Seiler, Brian Robert Brown, Mark Henry Bonwick, Quentin Scott, Robert Goh, Ross Halgren
  • IMPROVED VDM AND/DROP MULTIPLEXER MODULE
    Publication number: 20030128512
    Abstract: A chassis member for carrying at least one circuit board for use in a WDM add/drop multiplexer unit, wherein the chassis member is adapted, in use, to function as a heatsink for a heat generating component mounted on the circuit board.
    Type: Application
    Filed: December 18, 2002
    Publication date: July 10, 2003
    Inventors: Mark J. Owens, Chia Seiler, Brian Robert Brown, Mark Henry Bonwick, Quentin Scott, Robert Goh, Ross Halgren
  • WDM add/drop multiplexer module
    Publication number: 20030117771
    Abstract: A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for maintaining a controlled temperature environment inside of the component.
    Type: Application
    Filed: December 21, 2001
    Publication date: June 26, 2003
    Inventors: Mark J. Owens, Chia Seiler, Brian Robert Brown, Mark Henry Bonwick, Quentin Scott, Robert Goh, Ross Halgren