Abstract: A semiconductor assembly includes semiconductor elements connected to a first conductor track of a substrate. A current path impedance is embodied from each semiconductor element to a connection element. A first bond connector connects a contact surface on a substrate-distal side of each semiconductor element to a second conductor track of the substrate. Electrically conductive parallel connections transverse to a current direction connect the second conductor track to a third conductor track of the substrate. The third conductor track is connected to the connection element. The electrically conductive connections are dimensioned and/or arranged to substantially balance the current path impedances of the current paths from the semiconductor elements to the connection element. A second bond connector connects the third conductor track to the connection element. The second and third conductor tracks of the substrate each have a measurement tap to detect a current through the electrically conductive connections.

Abstract: A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.

Abstract: A power module unit, in particular for a frequency converter, includes a base plate having a first side provided with a recess and a second side, a cooling fin fastened in the recess of the base plate at least in one region by a positive fit, a material fit, and/or a non-positive fit, and a substrate provided for a power semiconductor and disposed on the second side of the base plate.

Abstract: A power module includes at least two power semiconductor arrangements, each having at least one semiconductor component, in contact with substrate and arranged in a housing. To improve the reliability of the power module, a first power connector and a second power connector are arranged on a first side of the housing and at least one other power connector is arranged on an opposing second side of the housing. Supply lines extending from the power connectors to the power semiconductor arrangements are arranged on the substrate in such a manner that electrical current is provided in a symmetrical manner.