Patents by Inventor Robert Grencavich

Robert Grencavich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photonic integrated circuit (PIC) chips
    Patent number: 7519246
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: April 14, 2009
    Assignee: Infinera Corporation
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Jr., Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Ting-Kuang Chiang, Robert Grencavich, Vinh D. Nguyen, Donald J. Pavinski, Jr., Marco E. Sosa
  • Photonic Integrated Circuit (PIC) Chips
    Publication number: 20080031626
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Application
    Filed: October 9, 2007
    Publication date: February 7, 2008
    Applicant: INFINERA CORPORATION
    Inventors: David Welch, Vincent Dominic, Fred Kish, Mark Missey, Radhakrishnan Nagarajan, Atul Mathur, Frank Peters, Robert Taylor, Matthew Mitchell, Alan Nilsson, Stephen Grubb, Richard Schneider, Charles Joyner, Jonas Webjorn, Ting-Kuang Chiang, Robert Grencavich, Vinh Nguyen, Donald Pavinski, Marco Sosa
  • Submount for a photonic integrated circuit (PIC) chip
    Patent number: 7062114
    Abstract: A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: June 13, 2006
    Assignee: Infinera Corporation
    Inventors: Jonas Webjorn, Robert Grencavich, Vinh D. Nguyen, Donald J. Pavinski, Jr.
  • Submount for a photonic integrated circuit (PIC) chip
    Publication number: 20050025409
    Abstract: A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.
    Type: Application
    Filed: May 25, 2004
    Publication date: February 3, 2005
    Applicant: Infinera Corporation
    Inventors: David Welch, Vincent Dominic, Fred Kish, Mark Missey, Radhakrishnan Nagarajan, Atul Mathur, Frank Peters, Robert Taylor, Matthew Mitchell, Alan Nilsson, Stephen Grubb, Richard Schneider, Charles Joyner, Jonas Webjorn, Ting-Kuang Chiang, Robert Grencavich, Vinh Nguyen, Donald Pavinski, Marco Sosa
  • Transmitter photonic integrated circuit ( TxPIC) chips
    Publication number: 20040067006
    Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
    Type: Application
    Filed: December 11, 2002
    Publication date: April 8, 2004
    Inventors: David F. Welch, Vincent G. Dominic, Fred A. Kish, Mark J. Missey, Radhakrishnan L. Nagarajan, Atul Mathur, Frank H. Peters, Robert B. Taylor, Matthew L. Mitchell, Alan C. Nilsson, Stephen G. Grubb, Richard P. Schneider, Charles H. Joyner, Jonas Webjorn, Ting-Kuang Chiang, Robert Grencavich, Vinh D. Nguyen, Donald J. Pavinski, Marco E. Sosa
  • Hermetic solder lid closure
    Patent number: 5993931
    Abstract: A method for leak testing of a hermetic package closure comprises the steps of: creating a pocket in a lid; plating the lid; placing solder in the pocket; melting the solder in the pocket; drilling a hole through the solder and the plated lid creating an unplated area on the plated lid; testing the hermetic package closure for leaks through the hole; heating the solder reflow, wherein surface tension of the solder over the hole and the unplated area enable the solder to form a hermetic closure.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: November 30, 1999
    Assignee: Lucent Technologies Inc
    Inventor: Robert Grencavich