Abstract: A method for annealing a structure formed by electrodeposition is provided, the method comprising providing the electrodeposition structure, the electrodeposition structure comprising an electroformed mold, the electroformed mold having a nominal thickness between and including 0.5 mm to 8.0 mm and having a melting temperature; heating the electrodeposition structure to a temperature between ambient temperature and the melting temperature of the electrodeposition structure; isostatically pressurizing the electrodeposition structure to a pressure above ambient pressure; cooling the electrodeposition structure to ambient temperature; and depressurizing the electrodeposition structure to ambient pressure.

Abstract: A method for annealing a structure formed by electrodeposition is provided, the method comprising providing the electrodeposition structure, the electrodeposition structure comprising an electroformed mold, the electroformed mold having a nominal thickness between and including 0.5 mm to 8.0 mm and having a melting temperature; heating the electrodeposition structure to a temperature between ambient temperature and the melting temperature of the electrodeposition structure; isostatically pressurizing the electrodeposition structure to a pressure above ambient pressure; cooling the electrodeposition structure to ambient temperature; and depressurizing the electrodeposition structure to ambient pressure.

Abstract: A method for annealing a structure formed by electrodeposition including providing the electrodeposition structure, the electrodeposition structure including an eletroformed mold, the electroformed mold having a nominal thickness between and including 0.5 mm to 8.0 mm and having a melting temperature; heating the electrodeposition structure to a temperature between ambient temperature and the melting temperature of the electrodeposition structure; isostatically pressurizing the electrodeposition structure to a pressure above ambient pressure; cooling the electrodeposition structure to ambient temperature; and depressurizing the electrodeposition structure to ambient pressure.

Abstract: A method for annealing a structure formed by electrodeposition is provided, the method comprising providing the electrodeposition structure, the electrodeposition structure comprising an electroformed mold, the electroformed mold having a nominal thickness between and including 0.5 mm to 8.0 mm and having a melting temperature; heating the electrodeposition structure to a temperature between ambient temperature and the melting temperature of the electrodeposition structure; isostatically pressurizing the electrodeposition structure to a pressure above ambient pressure; cooling the electrodeposition structure to ambient temperature; and depressurizing the electrodeposition structure to ambient pressure.

Abstract: A method for testing foam formulations for the quantitative measure of the effects of formulation and/or process variable changes on some kinds of surface problems of a molded part caused by different degrees of imperfection or voiding underneath the part surface. The molded part can be single component or composite, solid or foamed. One example of the surface problem is the so-called "measles or cellulite" problem observed on the vinyl surface of a vinyl/foam composite due to the voids or rattiness within the foam. To accomplish this result, the mold has various sized, spaced apart, aligned openings formed in each of the front and rear walls of the mold, but with the centers thereof at different elevations in the respective front and rear walls. Removable rods inserted through the aligned mold wall openings produce longitudinal openings through the part which is molded around the rods, permitting the effect thereof on the surface of the molded part to be evaluated.

Abstract: This disclosure illustrates and describes a test mold for the quantitative measure of the effects of formulation and/or process variable changes on some kinds of surface problems of a molded part caused by different degrees of imperfection or voiding underneath the part surface. The molded part can be single component or composite, solid or foamed. One example of the surface problem is the so-called "measles or cellulite" problem observed on the vinyl surface of a vinyl/foam composite due to the voids or rattiness within the foam. To accomplish this result, the mold has various sized, spaced apart, aligned openings formed in each of the front and rear walls of the mold, but with the centers thereof at different elevations in the respective front and rear walls. Removable rods inserted through the aligned mold wall openings produce longitudinal openings through the part which is molded around the rods, permitting the effect thereof on the surface of the molded part to be evaluated.