Abstract: An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.

Abstract: An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.

Abstract: An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.

Abstract: Digitizing apparatus comprises an array of Hall effect elements. The array includes conditioning circuitry and scanning circuitry for sensing the conditions of all Hall effect elements and determining which elements have been actuated by a user manipulated magnetic actuator. The apparatus inputs digital signals into a computer, the signals indicating relative positions of actuated Hall effect elements.

Abstract: A computer system having a peripheral bus and a digital signal processor (DSP) local bus interfacing to the peripheral bus via an extended bus interface circuit (EBIC). The DSP local bus is configured such that devices, which are typically two or more DSPs, electrically connected to the DSP local bus may transfer data to other devices connected to the DSP local bus regardless of data transfer activity of the peripheral bus. Moreover, as seen from the peripheral bus, the devices connected to the DSP local bus have the same arbitration level. However, as seen from the DSP local bus, each device connected to the DSP local bus has a unique arbitration level determined by the priority of the tasks executing on the respective devices, as determined by a DSP operating system.