Patents by Inventor Robert H. C. Janssen
Robert H. C. Janssen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20190153192Abstract: The present invention relates to a heat-processable thermally conductive polymer composition comprising (a) 30 to 95% by weight of a thermoplastic polymer (b) 5 to 40% by weight of a graphite powder; and (c) 0 to 65% by weight of optional further component(s), wherein the particles of the graphite powder are in the form of platelets having a thickness of less than 500 nm, and a process for the preparation heat-processable thermally conductive polymer composition.Type: ApplicationFiled: January 22, 2019Publication date: May 23, 2019Inventors: Abel Frans POT, Hans K. VAN DIRK, Robert H.C. JANSSEN
-
Patent number: 8975325Abstract: Non-fibrous-reinforced thermoplastic molding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.Type: GrantFiled: June 2, 2014Date of Patent: March 10, 2015Assignee: DSM IP Assets B.V.Inventors: Pieter Gijsman, Wilhelmus J. M. Sour, Rudy Rulkens, Robert H. C. Janssen
-
Patent number: 8969460Abstract: A thermostabilized thermoplastic molding composition includes a) a thermoplastic polyamide composition which consists of a blend of at least two polyamides. The at least two polyamides include a1) at least 50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1) selected from the group consisting of polyamide-4,6, polyamide-6,6 and semi-aromatic polyamides and mixtures thereof; and a2) an amount of 1-50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a second polyamide (PA-2) selected from the group consisting of polyamide-6 and copolymers thereof. The composition also contains b) 0.001-3 mass %, relative to the total mass of the thermoplastic polyamide composition, of a copper salt; and c) 0.01-10 mass %, relative to the total mass of the thermoplastic polyamide composition, of iron oxide. The molding composition exhibits reduced deterioration when exposed to an elevated temperature of 230° C.Type: GrantFiled: May 27, 2014Date of Patent: March 3, 2015Assignee: DSM IP Assets B.V.Inventors: Pieter Gijsman, Wilhelmus J. M. Sour, Rudy Rulkens, Robert H. C. Janssen
-
Publication number: 20140288224Abstract: Non-fibrous-reinforced thermoplastic moulding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.Type: ApplicationFiled: June 2, 2014Publication date: September 25, 2014Applicant: DSM IP ASSETS B.V.Inventors: Pieter GIJSMAN, Wilhelmus J.M. SOUR, Rudy RULKENS, Robert H.C. JANSSEN
-
Publication number: 20140275385Abstract: A thermostabilized thermoplastic moulding composition includes a) a thermoplastic polyamide composition which consists of a blend of at least two polyamides. The at least two polyamides include a1) at least 50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1) selected from the group consisting of polyamide-4,6, polyamide-6,6 and semi-aromatic polyamides and mixtures thereof; and a2) an amount of 1-50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a second polyamide (PA-2) selected from the group consisting of polyamide-6 and copolymers thereof. The composition also contains b) 0.001-3 mass %, relative to the total mass of the thermoplastic polyamide composition, of a copper salt; and c) 0.01-10 mass %, relative to the total mass of the thermoplastic polyamide composition, of iron oxide. The moulding composition exhibits reduced deterioration when exposed to an elevated temperature of 230° C.Type: ApplicationFiled: May 27, 2014Publication date: September 18, 2014Applicant: DSM IP ASSETS B.V.Inventors: Pieter GIJSMAN, Wilhelmus J.M. SOUR, Rudy RULKENS, Robert H.C. JANSSEN
-
Patent number: 8772394Abstract: The invention relates to a thermostabilized thermoplastic molding composition comprising (a) a thermoplastic polyamide composition, consisting of a blend of at least two polyamides comprising (a.1) at least 50% mass, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1), being a semi-crystalline polyamide having a melting point Tm-1, or being an amorphous polyamide having a glass transition point Tg-1, wherein Tm-1 and Tg-1 together are denoted as T-1 and T-1 is at least 200° C. and (a.2) a second polyamide (PA-2), with a C/N ratio of at most 7, being a semi-crystalline polyamide having a melting point Tm-2 or an amorphous polyamide having a glass transition point Tg-2, wherein Tm-2 and Tg-2 together are denoted as T-2 and T-2 is at least 20° C.Type: GrantFiled: January 12, 2006Date of Patent: July 8, 2014Assignee: DSM IP Assets B.V.Inventors: Pieter Gijsman, Wilhelmus J. M. Sour, Rudy Rulkens, Robert H. C. Janssen
-
Patent number: 8772397Abstract: Non-fibrous-reinforced thermoplastic moulding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.Type: GrantFiled: January 9, 2006Date of Patent: July 8, 2014Assignee: DSM IP Assets B.V.Inventors: Pieter Gijsman, Wilhelmus J. M. Sour, Rudy Rulkens, Robert H. C. Janssen
-
Patent number: 8189335Abstract: Heat transport assemblies are provided with a first part plastic part and a second part. The heat transport assemblies have a first surface area on the first part in heat conductive contact with a second surface area on the second part, wherein the first surface area and the second surface area consist of a surface material having a heat conductivity of at least 50 W/m·K.Type: GrantFiled: January 29, 2008Date of Patent: May 29, 2012Assignee: DSM IP Assets B.V.Inventors: Robert H. C. Janssen, Jacob Koenen, Franciscus Van Vehmendahl
-
Patent number: 8138245Abstract: The invention relates to a halogen free flame retardant polyester composition suitable for use as a molding composition for making lampholders, comprising (A) a polymeric material consisting for at least 50 wt. %, relative to the total weight of the polymeric material, of a thermoplastic polyester; (B) a flame retardant system in an amount of 11-35 wt. %, relative to the total weight of (A), (B) and (C), and consists of: melamine cyanurate, and optionally one or more of the following flame retardant components: another phosphorus-free nitrogen based organic flame retardant compound, a phosphorus containing flame retardant excluding elementary phosphorus, in an amount of less than 1 wt. %, relative to the total weight of (A), (B) and (C); an inorganic flame retardant synergist, and an organic flame retardant synergist (C) a fibrous reinforcing agent in an amount of 5-35 wt. %, relative to the total weight of (A), (B) and (C); and (D) a mould release agent in an amount of at least 0.01 wt.Type: GrantFiled: April 2, 2007Date of Patent: March 20, 2012Assignee: DSM IP Assets B.V.Inventors: Ronald M. A. M. Schellekens, Robert H. C. Janssen, Theodorus J. G. Zwartkruis, Franciscus Vehmendahl Van
-
Publication number: 20100283001Abstract: The present invention relates to a heat-processable thermally conductive polymer composition comprising (a) 30 to 95% by weight of a thermoplastic polymer (b) 5 to 40% by weight of a graphite powder; and (c) 0 to 65% by weight of optional further component(s), wherein the particles of the graphite powder are in the form of platelets having a thickness of less than 500 nm, and a process for the preparation heat-processable thermally conductive polymer composition.Type: ApplicationFiled: September 30, 2008Publication date: November 11, 2010Inventors: Abel F. Pot, Hans K. Dijk Van, Robert H.C. Janssen
-
Publication number: 20100118495Abstract: The invention relates to a heat transport assembly comprising a first part being a plastic part and a second part, and having a first surface area on the first part in heat conductive contact with a second surface area on the second part, wherein the first surface area and the second surface area consist of a surface material having a heat conductivity of at least 50 W/m-K.Type: ApplicationFiled: January 29, 2008Publication date: May 13, 2010Inventors: Robert H.C. Janssen, Jacob Koenen, Franciscus Van Vehmendahl
-
Publication number: 20100056677Abstract: The invention relates to halogen free flame retardant thermoplastic polymer composition comprising a halogen free flame retardant system, a thermoplastic polyester and an amount of 1-20 wt. % of soft blocks chemically bonded to the thermoplastic polyester. The invention also relates to the use of the halogen free flame retardant thermoplastic polymer composition for making fibres, films and injection or extrusion moulded parts.Type: ApplicationFiled: June 18, 2007Publication date: March 4, 2010Applicant: DSM IP ASSETS B.V.Inventors: Robert H.C. Janssen, Monique A.M. Walet
-
Publication number: 20100020559Abstract: The invention relates to a lamp socket consisting at least partially of a plastic composition having a through plane thermal conductivity of at least 0.5 W/m.K. The plastic composition may comprise a thermoplastic polymer and a thermally conductive filler and/or a thermally conductive fibrous material. For example, the plastic composition may comprise a semicrystalline polyamide having a melting point of at least 200° C., glass fibres and boron nitride. The tendency to fogging is reduced.Type: ApplicationFiled: July 9, 2007Publication date: January 28, 2010Inventors: Robert H. C. Janssen, Hans K. Dijk Van
-
Publication number: 20090264562Abstract: The invention relates to a halogen free flame retardant polyester composition suitable for use as a moulding composition for making lampholders, comprising (A) a polymeric material consisting for at least 50 wt. %, relative to the total weight of the polymeric material, of a thermoplastic polyester; (B) a flame retardant system in an amount of 11-35 wt. %, relative to the total weight of (A), (B) and (C), and consists of: melamine cyanurate, and optionally one or more of the following flame retardant components: another phosphorus-free nitrogen based organic flame retardant compound, a phosphorus containing flame retardant excluding elementary phosphorus, in an amount of less than 1 wt. %, relative to the total weight of (A), (B) and (C); an inorganic flame retardant synergist, and an organic flame retardant synergist (C) a fibrous reinforcing agent in an amount of 5-35 wt. %, relative to the total weight of (A), (B) and (C); and (D) a mould release agent in an amount of at least 0.01 wt.Type: ApplicationFiled: April 2, 2007Publication date: October 22, 2009Applicant: DSM IP ASSETS B.V.Inventors: Ronald M.A.M Schellekens, Robert H.C. Janssen, Theodorus J.G. Zwartkruis, Franciscus Vehmendahl Van
-
Publication number: 20090105381Abstract: The invention relates to A polyester moulding composition consisting of (A) 100 parts by weight (pbw) of a polymer composition consisting of (A-i) at least 50 pbw of a thermoplastic polyester, and, optionally, (A-ii) at least one other polymer, (B) between 2 and 40 pbw of a flame retardant system consisting of (B-i) a nitrogen based organic flame retardant compound free of phosphorus or a phosphorus free salt thereof, and, optionally, (B-ii) less than 1 pbw of a phosphorus containing flame retardant compound, (C) between 0.01 and 1 pbw of a mould release agent, and optionally (D) 0-10 pbw of a fibrous reinforcing agent, and (E) 0-100 pbw of other additives. The invention also relates to the use of the composition for making molded parts, in particular part for use in electrical or electronic applications, and to these molded parts.Type: ApplicationFiled: April 21, 2006Publication date: April 23, 2009Inventors: Egbert W. Kuijk, Theodorus J.G. Zwartkruis, Robert H.C. Janssen
-
Publication number: 20080146717Abstract: The invention relates to a thermostabilized thermoplastic moulding composition comprising (a) a thermoplastic polyamide composition, consisting of a blend of at least two polyamides comprising (a.1) at least 50% mass, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1), being a semi-crystalline polyamide having a melting point Tm-1, or being an amorphous polyamide having a glass transition point Tg-1, wherein Tm-1 and Tg-1 together are denoted as T-1 and T-1 is at least 200° C. and (a.2) a second polyamide (PA-2), with a C/N ratio of at most 7, being a semi-crystalline polyamide having a melting point Tm-2 or an amorphous polyamide having a glass transition point Tg-2, wherein Tm-2 and Tg-2 together are denoted as T-2 and T-2 is at least 20° C.Type: ApplicationFiled: January 12, 2006Publication date: June 19, 2008Inventors: Pieter Gijsman, Wilhelmus J.M. Sour, Rudy Rulkens, Robert H.C. Janssen
-
Publication number: 20080146718Abstract: The invention relates to non-fibrous-reinforced thermoplastic moulding compositions comprising a metal powder as a heat stabilizer wherein the metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof, and next to the said metal powders a thermoplastic polyamide with an Mw of at most 50.000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer.Type: ApplicationFiled: January 9, 2006Publication date: June 19, 2008Inventors: Pieter Gijsman, Wilhelmus J.M. Sour, Rudy Rulkens, Robert H.C. Janssen