Abstract: A printed circuit board (PCB) comprises a number of electrically conductive layers. Instead of coating, or plating, a PCB through-hole with an electrically conductive material to form a via (for the purpose of connecting together signal paths across the electrically conductive layers)—the via is formed by placing a conductive stake, or conductive pin, in the through-hole.

Abstract: Apparatus and methods for defining circuit routing paths between electronic components on a substrate are disclosed. A method according to the invention includes associating one or more routing rules with connections between the components, wherein at least one of the routing rules is a minimum length routing rule; defining a first set of routing paths between the components while ignoring the minimum length routing rule; and modifying the first set of routing paths by enforcing the minimum length routing rule. Apparatus for defining circuit routing paths between components on a substrate includes a database and a routing engine that accepts the database as input. The database has an entry that includes a connection that is represented by a signal traveling between a start point and an end point on the substrate, and a set of routing rules associated with the connection. The set of routing rules includes at least a minimum length routing rule.