Patents by Inventor Robert H. Foster

Robert H. Foster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive plastic overmold on shielded plastic window
    Patent number: 9072162
    Abstract: An integrated assembly is provided for installation on a housing for electronic components. The integrated assembly includes a shielded window and a bezel overmolded onto the shielded window in an injection molding process. Since both the shielded window and the bezel have EMI resistant properties, the assembly represents an efficient method for providing high quality EMI shielding while eliminating the use of costly parts and assembly procedures.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: June 30, 2015
    Assignee: Parker-Hannifin Corporation
    Inventors: Matthew Finley, John Perkins, Peter Z. Torok, Robert H. Foster, Robert Cowperthwait, John H. Beswick, David Inman
  • CONDUCTIVE PLASTIC OVERMOLD ON SHIELDED PLASTIC WINDOW
    Publication number: 20120201011
    Abstract: An integrated assembly is provided for installation on a housing for electronic components. The integrated assembly includes a shielded window and a bezel overmolded onto the shielded window in an injection molding process. Since both the shielded window and the bezel have EMI resistant properties, the assembly represents an efficient method for providing high quality EMI shielding while eliminating the use of costly parts and assembly procedures.
    Type: Application
    Filed: November 19, 2010
    Publication date: August 9, 2012
    Applicant: PARKER-HANNIFIN CORPORATION
    Inventors: Matthew Finley, John Perkins, Peter Z. Torok, Robert H. Foster, Robert Cowperthwait, John H. Beswick, David Inman
  • EMI ABSORBING GAP FILLING MATERIAL
    Publication number: 20080012103
    Abstract: A thermally conductive gap filling material for the absorption of electromagnetic (EM) radiation emitted from an electronic device is provided. The gap filling material facilitates conduction of excessive heat generated by the electronic device to a heat dissipater. The heat dissipater further dissipates the excessive heat to the surrounding environment. The gap filling material comprises a binder material and magnetic filler. The magnetic filler is dispersed in binder material. The magnetic filler absorbs EM radiation and causes the gap filling material to be thermally conductive.
    Type: Application
    Filed: July 13, 2007
    Publication date: January 17, 2008
    Inventors: Robert H. Foster, Michael H. Bunyan