Abstract: Disclosed is an interface for testing an integrated circuit device through a plurality of contacts on an exposed surface of the device. The interface comprises a flexible sheeting having first and second opposing surfaces. A plurality of contacts are disposed on the first surface of the sheet in a pattern designed to mate with a plurality of contacts on an integrated circuit device. A plurality of thin film conductors are patterned on the sheet, the conductors each being connected to a contact on the sheet and being adapted for connection to a circuit for testing the device. The interface comprises apparatus for preforming into a generally domed shape a portion of the sheet which includes a plurality of the contacts and apparatus for flexing the flexible sheet so that the contacts on both the sheet and the device may be brought into intimate contact.

Abstract: To minimize the deposition of materials in portions of a microcircuit structure beyond those intended to be deposited upon through openings in a mask, a special mask holding arrangement is used. This arrangement can be used with several deposition methods which include sputtering and evaporation as well as supplementing these with plating techniques.