Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.

Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.

Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.

Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.

Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.

Abstract: Disclosed is methodology and apparatus for producing a planar inductor having a high quality (Q) factor. The inductor is formed by providing a first, relatively wide coil turn, and at least a pair of relatively more narrow second coil turns, displaced in a different plane from that occupied by the first coil turn. The configuration of such coil turns produces a high value of mutual coupling among the coil turns, resulting in an inductor having a high quality (Q) factor.

Abstract: An electronic device and process of making the device is disclosed. The device includes a multi-sided body defined by a plurality of electrode plates arranged in a stack. A resin layer is applied to both conductive and semiconductive regions of the device, and metal is plated upon terminals to create a conductive element. The device may be a varistor, thermistor, resistor, or other microelectronic component having a multi-sided body and terminal structures that are capable of receiving a resin coating. The multi-sided body has a resin coating on at least a portion of an exterior surface, the resin coating substantially preventing plating of metal onto the exterior surface of the body. One suitable resin coating that may be employed is a thermoset resin comprising a B-staged divinylsiloxane-bis(benzocyclobutene)(i.e. “BCB”) resin dissolved in mesitylene solvent.

Abstract: Both discrete and array RC components are described using cofireable resistive material as part of internal electrodes of the device. The devices include a sintered body of multilayer ceramic material in which multiple first and second electrode layers are stacked. Each of the first layers comprises at least one resistive electrode pattern extending across the sintered body between respective pairs of terminations. The second layers comprise an electrode pattern extending transverse to the resistive electrode pattern, such as between end terminations. In some embodiments, opposing side electrodes serve as input and output terminals of a respective feedthrough filter. In a feedthrough arrangement, the third terminal may be provided by one or both of the end terminals. The invention also describes an improved termination structure including a layer made from a metal oxide material.

Abstract: A very small electronic device adapted for inverted mounting to a circuit board includes a multiplicity of capacitors and resistors built on a substrate. The capacitors and resistors are interconnected so as to provide multiple RC circuits in various circuit arrangements. The multiple layers of the device are covered by an encapsulate having openings to expose terminal pads of the RC circuits. The openings are filled with solder to produce the individual terminations of the device in a ball grid array (BGA). The device saves cost and/or board space in the manufacture of larger electronic equipment through the elimination of multiple discrete components. In addition, very low inductance is achieved due to the close proximity of the device to a circuit board on which it is mounted.

Abstract: Subject a heated, non-molten, intimate admixture of a base metal and a superconducting oxide material to pressure sufficient to form a densified article. The densified article is either superconducting as formed or capable of being rendered superconducting by annealing in the presence of oxygen. Depending upon the choice of materials the densified article is stable at temperatures up to 1000.degree. C.

Abstract: Thin, free-standing ceramic precursor tapes are prepared from solutions comprising certain coordination complexes, thus eliminating the use of ceramic powders. The precursor tapes can be calcined to form thin ceramic sheets useful in electronic applications.

Abstract: Methods of producing ABO.sub.3 compounds in which A represents a first metal ion and B represents a second metal ion from mixed metal coordination complexes are disclosed. The methods involve reacting compounds serving as a source of the B metal ion with a substituted aromatic compound, in solution, and thereafter reacting the metal coordination complex formed with a compound serving as a source of the A metal, in solution. An example is the reaction of titanium tetraisopropoxide with catechol to form a titanium catecholate coordination complex which is thereafter reacted with barium hydroxide octahydrate to form a pentamethanol barium triscatecholatotitanate mixed metal coordination complex which can be calcined at elevated temperatures to produce the ABO.sub.3 compound, barium titanate (BaTiO.sub.3), which is known to have outstanding dielectric, ferroelectric and piezoelectric properties. Portions of the A and/or B ions can be substituted with other metals.

Abstract: Methods of producing ABO.sub.3 compounds in which A represents a first metal ion and B represents a second metal ion from mixed metal coordination complexes are disclosed. The methods involve reacting compounds serving as a source of the B metal ion with a substituted aromatic compound, in solution, and thereafter reacting the metal coordination complex formed with a compound serving as a source of the A metal, in solution. An example is the reaction of titanium tetraisopropoxide with catechol to form a titanium catecholate coordination complex which is thereafter reacted with barium hydroxide octahydrate to form a pentamethanol barium triscatecholatotitanate mixed metal coordination complex which can be calcined at elevated temperatures to produce the ABO.sub.3 compound, barium titanate (BaTiO.sub.3), which is known to have outstanding dielectric, ferroelectric and piezoelectric properties. Portions of the A and/or B ions can be substituted with other metals.

Abstract: Prepare highly pure zinc oxide spherodial particles of narrow size distribution and having a mean particle diameter of from about 0.1 to about 0.3 .mu.m by hydrolyzing hydrocarbyl zinc hydrocarboxides, such as ethyl zinc t-butoxide.

Abstract: 2-Substituted-1,3-dioxacycloalkanes (also known as acetonides) (such as ##STR1## (4-hydroxy-2,2-dimethyl-1,3-benzodioxole)) are prepared by reacting a diol (such as 1,2,3-trihydroxybenzene) and a diunsaturated ether (such as diisopropenyl ether). The reaction is exothermic and produces a ketone as the only by-product. The invention has utility in hydroxyl moiety "protection" and in pesticide synthesis.

Abstract: An improved, flexible, strong, thin precursor green tape for dielectric ceramics is described. The tape is prepared from a cellulosic resin of specific characteristics. The tape is especially useful in the preparation of multilayer capacitors and related electronic devices.

Abstract: An improved, flexible, strong, thin precursor green tape for dielectric ceramics, the tape being prepared from ethylcellulose of specific characteristics. The tape is especially useful in the preparation of multilayer capacitors and related electronic devices.