Abstract: A test system including a package with switchable paths. The package may have conductive paths that are selected by switches. The electrically switchable conductive paths may yield increased data without significantly increasing the required testing hardware.

Abstract: A test system including a package with interconnect paths. The package may have electrical paths that are electrically connected by the interconnect paths. The electrically connected electrical paths may yield increased data without significantly increasing the required testing hardware.

Abstract: A test system including a package with interconnect paths. The package may have electrical paths that are electrically connected by the interconnect paths. The electrically connected electrical paths may yield increased data without significantly increasing the required testing hardware.

Abstract: A test system including a package with switchable paths. The package may have conductive paths that are selected by switches. The electrically switchable conductive paths may yield increased data without significantly increasing the required testing hardware.

Abstract: Apparatus, systems, and methods are provided for testing the integrity of electrical interconnections in electronic systems. Apparatus may be constructed by modifying a substrate designed for deployment in an end-use product by shorting together multiple contacts on one side of it. Such vehicles may be used to test the characteristics of interconnections between the vehicle and its support, the shorted contacts enabling testing of individual interconnects under both DC and AC conditions. A system for testing the interconnects may include the modified substrate, an input signal generator, and an output signal monitor.