Abstract: The disclosed calibration method includes a calibration phantom positioned on an adjustable table on the surface of a mechanical couch, with the phantom's centre at an estimated location for the iso-centre of a radio therapy treatment apparatus. The calibration phantom is then irradiated using the apparatus, and the relative location of the center of the calibration phantom and the iso-centre of the apparatus is determined by analyzing images of the irradiation of the calibration phantom. The calibration phantom is then repositioned by the mechanical couch applying an offset corresponding to the determined relative location of the centre of the calibration phantom and the iso-centre of the apparatus to the calibration phantom. Images of the relocated calibration phantom are obtained, to which the offset has been applied, and the obtained images are processed to set the co-ordinate system of a stereoscopic camera system relative to the iso-centre of the apparatus.

Abstract: A reinforcing system for a vessel that can contain water is described. The system includes a shell for containing water, the shell having one or more jets extending therethrough from an inside of the shell to an outside of the shell, and a structural support layer on an underside of the shell. The structural support layer can include: an inner layer of rigidizer applied to the underside of the shell, a central low density core, and an outer layer of rigidizer applied to the central low-density core. The structural support layer can extend from a bottom side of the underside of the shell, across at least one sidewall of the underside of the shell, and form at least one rib along the sidewall of the underside of the shell.

Abstract: A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.

Abstract: A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.

Abstract: Systems, methods, and devices for performing a layer-2 scan of one or more communication networks to collect detailed information regarding the components/devices attached to the networks at a particular location (e.g., metropolitan area, city, university campus, building, floor within a building, etc.), and using the collected detailed information to generate a device profile for each of the devices attached to the one or more communication networks at the particular location. A server computing device may use the generated device profiles to perform inventory control operations, wireless vendor integration operations and/or security operations. For example, the server may use the device profiles to determine whether a component/device attached to any of the networks is non-benign (e.g., improperly configured, running malware, operated by hacker, spoofing a server, dropping packets, etc.), and initiate a reactive or mitigating action (e.g., quarantine the device, etc.).

Abstract: Apparatus, systems, and methods for attaching an assembled wall module to a building structure, according to which a framing section, including a plurality of structural members and a first coupler connected to a first structural member of the plurality of structural members, is connected to the building structure. After connecting the framing section to the building structure, relative movement is permitted, via the first coupler, between the framing section and the building structure in a first direction. Before connecting the framing section to the building structure, a plurality of sheeting sections may be connected to the framing section. The framing section may further include a second coupler; in such instances, after connecting the framing section to the building structure, relative movement is permitted, via the second coupler, between the framing section and the building structure in a second direction, which second direction is the same as the first direction.

Abstract: An apparatus, system, and method for lifting an assembled wall module into position for attachment to a building structure.

Abstract: A device for analyzing or inspecting a prepared portion of a power cable includes a cable gripping section to grip a portion of the power cable proximate to a prepared end of the power cable, where the cable end has been prepared by removing certain portions of the power cable so that it can properly accept an electrical or cable accessory, such as a splice or termination. The device also includes an imaging device holding section to hold an imaging device at a predetermined radial distance from the prepared cable end. In particular, the imaging device holding section is radially and axially adjustable in position. During inspection of the prepared cable end, the imaging device is fully rotated about the prepared cable end to acquire a 360 degree image of the prepared cable end.

Abstract: An apparatus, system, and method for lifting an assembled wall module into position for attachment to a building structure.

Abstract: A system includes a cutting sub-system arranged for cutting a box into a first half and a second half and including at least one pair of cutting elements, a dunnage gripper sub-system arranged downstream of the cutting sub-system and including a dunnage gripper configured to selectively grip and release a portion of the box, and a robotic system including at least a first robotic arm and a second robotic arm. The first robotic arm includes a plurality of grippers configured to selectively grip and release items contained in the box. The second robotic arm includes a plurality of grippers configured to selectively position the items into a tote positioned at a second predetermined location.

Abstract: An apparatus, system, and method for lifting an assembled wall module into position for attachment to a building structure.

Abstract: An apparatus, system, and method for lifting an assembled wall module into position for attachment to a building structure.

Abstract: Apparatus, systems, and methods for attaching an assembled wall module to a building structure, according to which a framing section, including a plurality of structural members and a first coupler connected to a first structural member of the plurality of structural members, is connected to the building structure. After connecting the framing section to the building structure, relative movement is permitted, via the first coupler, between the framing section and the building structure in a first direction. Before connecting the framing section to the building structure, a plurality of sheeting sections may be connected to the framing section. The framing section may further include a second coupler; in such instances, after connecting the framing section to the building structure, relative movement is permitted, via the second coupler, between the framing section and the building structure in a second direction, which second direction is the same as the first direction.

Abstract: Systems, methods, and devices for performing a layer-2 scan of one or more communication networks to collect detailed information regarding the components/devices attached to the networks at a particular location (e.g., metropolitan area, city, university campus, building, floor within a building, etc.), and using the collected detailed information to generate a device profile for each of the devices attached to the one or more communication networks at the particular location. A server computing device may use the generated device profiles to perform inventory control operations, wireless vendor integration operations and/or security operations. For example, the server may use the device profiles to determine whether a component/device attached to any of the networks is non-benign (e.g., improperly configured, running malware, operated by hacker, spoofing a server, dropping packets, etc.), and initiate a reactive or mitigating action (e.g., quarantine the device, etc.).

Abstract: The present invention consists of providing a drive shaft damper having a condensed radial size of most of the shaft damper insert along its length for the purposes of lowering the cost of freight and enabling easy installation of the product into the drive shaft. Parts can be inserted into a drive shaft without any radial interference, which then can expand after installation. End portions may have radial interference without compression or with minimal compression to seal the damper.

Abstract: Systems, methods, and computer-readable media are disclosed for detecting and rendering endnotes in digital content. A user selection of a link rendered at a first location in digital content may be detected and various filtering criteria may be evaluated to determine whether the link references a second location in the digital content that is associated with endnote content. If the link is determined to reference endnote content, the endnote content may be extracted and rendered in association with a portion of the digital content corresponding to the first location.

Abstract: A wafer carrier that exhibits a thin, low-profile includes a bottom support plate upon which a thinned semiconductor wafer may be positioned, with a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the two components. The bottom support plate is formed to include a plurality of apertures for pulling a vacuum through the carrier, as well as features that engage with the holding ring and alignment fiducials for properly registering the orientation of the wafer's surface with respect to the wafer carrier and other testing equipment using the wafer carrier.

Abstract: The present disclosure is directed to stabilized drill cuttings and a process to stabilize the drill cuttings recovered from drilling a well. The cuttings are mixed with an emulsifier and waxy binding agent and then passed through a centrifuge to separate the stabilized drill cuttings from liquid. The stabilized drill cuttings can then be disposed in a suitable landfill. The stabilized cuttings may also be processed to remove oil and/or bitumen from them, prior to disposal.