Patents by Inventor Robert Hammedinger

Robert Hammedinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Weldable contact and method for the production thereof
    Patent number: 8456022
    Abstract: A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the substrate surface. The under bump metallization is in direct contact with the parts of the substrate.
    Type: Grant
    Filed: February 9, 2006
    Date of Patent: June 4, 2013
    Assignee: Epcos AG
    Inventors: Robert Hammedinger, Konrad Kastner, Martin Maier, Michael Obesser
  • Flip-chip component production method
    Patent number: 7673386
    Abstract: The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and the component chip and has a planar or planarized surface, so that it contacts closely to the bottom side of the component chip. Different covers are proposed for the additional encapsulation.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: March 9, 2010
    Assignee: EPCOS AG
    Inventors: Alois Stelzl, Christian Bauer, Hans Krueger, Robert Hammedinger
  • Flip-Chip Component and Method for its Production
    Publication number: 20090071710
    Abstract: The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and the component chip and has a planar or planarized surface, so that it contacts closely to the bottom side of the component chip. Different covers are proposed for the additional encapsulation.
    Type: Application
    Filed: November 25, 2008
    Publication date: March 19, 2009
    Inventors: Alois Stelzl, Christian Bauer, Hans Krueger, Robert Hammedinger
  • WELDABLE CONTACT AND METHOD FOR THE PRODUCTION THEREOF
    Publication number: 20090020325
    Abstract: A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the substrate surface. The under bump metallization is in direct contact with the parts of the substrate.
    Type: Application
    Filed: February 9, 2006
    Publication date: January 22, 2009
    Inventors: Robert Hammedinger, Konrad Kastner, Martin Maier, Michael Obesser