Abstract: The present disclosure relates to apparatus, assemblies, combinations, and methods for infusing fluids by hollow microneedles.

Abstract: The present disclosure relates to apparatus, assemblies, combinations, and methods for infusing fluids by hollow microneedles.

Abstract: Systems and methods for delivering microneedles to a patient's skin are described. In one aspect, a system for delivering a microneedle array to a patient's skin surface is provided. The system includes a delivery apparatus with a housing, and an infusion device detachably received in the housing.

Abstract: The present disclosure relates to apparatus, assemblies, combinations, and methods for infusing fluids by hollow microneedles.

Abstract: The present disclosure relates to systems and methods for delivering microneedles to a patient's skin. In one aspect, the present disclosure provides a system for delivering a microneedle array to a patient's skin surface, the system comprising: a delivery apparatus including a housing; and an infusion device detachably received in the housing.

Abstract: Methods and devices for thermal processing of multiple samples at the same time are disclosed. The sample processing devices provide process arrays that include conduits useful in distributing sample materials to a group of process chambers located in fluid communication with the main conduits. The sample processing devices may include one or more of the following features in various combinations: deformable seals, process chambers connected to the main conduit by feeder conduits exiting the main conduit at offset locations, U-shaped loading chambers, and a combination of melt bonded and adhesively bonded areas.

Abstract: The present disclosure relates to apparatus, assemblies, combinations, and methods for infusing fluids by hollow microneedles.

Abstract: A dust collection device for a sanding tool comprising a bag having a sidewall and a coupler attached to the bag. The sidewall comprising a first filter layer, a second filter layer, and an outer support layer. The first filter layer comprising a plurality of fibrillated electrostatically charged electret fibers forming a nonwoven web; the first filter layer having a total pressure drop between about 0.1 to about 4.0 mm H2O, and the first filter layer having a total basis weight between about 50 to about 450 gram/m2. The second filter layer comprising a melt blown microfiber nonwoven web; the second filter layer having a total pressure drop between about between about 5.5 to about 20.0 mm H2O, and the second filter layer having a total basis weight between about 15 to about 75 grams/m2.

Abstract: Methods and devices for thermal processing of multiple samples at the same time are disclosed. The assemblies include carriers and sample processing devices with process arrays that include conduits useful in distributing sample materials to a group pf process chambers located in fluid communication with the main conduits. The sample processing devices may include one or more of the following features in various combinations: deformable seals, process chambers connected to the main conduit by feeder conduits exiting the main conduit at offset locations, U-shaped loading chambers, and a combination of melt bonded and adhesively bonded areas. The carriers may be used to apply selective compression to the sample processing devices.

Abstract: An adhesive removal system useful for removing a stretch release adhesive from a component includes a first member that engages with a component and an adhesive removal member that moves the adhesive and component relative to each other in order to stretch the adhesive and release the adhesive from a bond surface of the component. In some embodiments, the adhesive removal member applies a substantially uniform pulling force across the adhesive. The adhesive removal member may be manually actuated by a user or with the aid of an automated device. In some embodiments, the adhesive removal system comprises a rotatable portion that moves the adhesive relative to the component. In other embodiments, the adhesive removal system includes features that enable the first member and a second member, which is mechanically coupled to at least a portion of the adhesive extending from the component, to move relative to each other.

Abstract: A dust collection device for a sanding tool comprising a bag having a sidewall and a coupler attached to the bag. The sidewall comprising a first filter layer, a second filter layer, and an outer support layer. The first filter layer comprising a plurality of fibrillated electrostatically charged electret fibers forming a nonwoven web; the first filter layer having a total pressure drop between about 0.1 to about 4.0 mm H2O, and the first filter layer having a total basis weight between about 50 to about 450 gram/m2. The second filter layer comprising a melt blown microfiber nonwoven web; the second filter layer having a total pressure drop between about between about 5.5 to about 20.0 mm H20, and the second filter layer having a total basis weight between about 15 to about 75 grams/m2.

Abstract: A reel assembly includes a first hub defining an outer surface, a second hub co-axially disposed relative to the first hub, and a first movable member including a spooling surface that is movable to a position exterior to the outer surface to define at least a portion of an effective outer reel diameter of the assembly. The first and second hubs are manually rotatable relative to one another between a first rotational position and a second rotational position, the assembly being characterized by an expanded state in the first rotational position and a contracted state in the second rotational position where the effective outer reel diameter is greater in the expanded state than in the contracted state.

Abstract: Methods and devices for thermal processing of multiple samples at the same time are disclosed. The assemblies include carriers and sample processing devices with process arrays that include conduits useful in distributing sample materials to a group pf process chambers located in fluid communication with the main conduits. The sample processing devices may include one or more of the following features in various combinations: deformable seals, process chambers connected to the main conduit by feeder conduits exiting the main conduit at offset locations, U-shaped loading chambers, and a combination of melt bonded and adhesively bonded areas. The carriers may be used to apply selective compression to the sample processing devices.

Abstract: Methods and devices for thermal processing of multiple samples at the same time are disclosed. The sample processing devices provide process arrays that include conduits useful in distributing sample materials to a group pf process chambers located in fluid communication with the main conduits. The sample processing devices may include one or more of the following features in various combinations: deformable seals, process chambers connected to the main conduit by feeder conduits exiting the main conduit at offset locations, U-shaped loading chambers, and a combination of melt bonded and adhesively bonded areas.

Abstract: A preflux composition suitable for use as a preflux for protecting the solderability of copper during a heating cycle comprising rosin, antioxidant, and a solvent system comprised of glycol ether and terpene, process for protecting the solderability of copper which is to be subjected to a heating cycle prior to soldering comprising using said preflux composition, and articles comprising printed circuits or wiring boards which have copper areas coated with said preflux composition.

Abstract: A preflux composition suitable for use as a preflux for protecting the solderability of copper during a heating cycle comprising rosin, antioxidant, and a solvent system comprised of glycol ether and terpene and further including a dibasic acid, process for protecting the solderability of copper which is to be subjected to a heating cycle prior to soldering comprising using said preflux composition, and articles comprising printed circuits or wiring boards which have copper areas coated with said preflux composition.