Patents by Inventor Robert Harkness

Robert Harkness has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150159022
    Abstract: A composition comprises a perfluorinated solvent having at least one CF3 group selected from a perfluoropolyether solvent having a boiling point temperature of at least 120° C. at atmospheric pressure and a nitrogen-containing perfluorinated solvent. The composition further comprises a polyfluoropolyether silane. The composition forms layers having excellent physical properties, including durability and appearance, in addition to stain and smudge resistance.
    Type: Application
    Filed: July 10, 2013
    Publication date: June 11, 2015
    Applicant: Dow Corning Corporation
    Inventors: Michael L. Bradford, Brian Robert Harkness, Hyun Daesup, Ryan Frederick Schneider
  • Patent number: 8486615
    Abstract: A method for preparing sensing devices (biosensors) includes the steps of: (1) applying a photopatternable silicone composition to a surface in a sensing device to form a film, (2) photopatterning the film by a process comprising exposing the film to radiation through a photomask without the use of a photoresist to produce an exposed film; (3) removing regions of the non-exposed film with a developing solvent to form a patterned film, which forms a permselective layer or an analyte attenuation layer covering preselected areas of the sensing device.
    Type: Grant
    Filed: June 21, 2005
    Date of Patent: July 16, 2013
    Assignee: Dow Corning Corporation
    Inventors: Geoffrey Bruce Gardner, Sina Maghsoodi, Brian Robert Harkness
  • Patent number: 8147742
    Abstract: A lithography method includes the steps of: A) filling a mold having a patterned surface with a phase change composition at a temperature above the phase change temperature of the phase change composition; B) hardening the phase change composition to form a patterned feature; C) separating the mold and the patterned feature; optionally D) etching the patterned feature; optionally E) cleaning the mold; and optionally F) repeating steps A) to D) reusing the mold. The PCC may include an organofunctional silicone wax.
    Type: Grant
    Filed: September 23, 2005
    Date of Patent: April 3, 2012
    Assignee: Dow Corning Corporation
    Inventors: Wei Chen, Brian Robert Harkness, Joan Sudbury-Holtschlag, Lenin James Petroff
  • Patent number: 7541264
    Abstract: A method for temporary wafer bonding employs an addition reaction curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a solvent. The film prepared by curing the composition is removable with an etching solution.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: June 2, 2009
    Assignee: Dow Corning Corporation
    Inventors: Geoffrey Bruce Gardner, Brian Robert Harkness
  • Publication number: 20090102089
    Abstract: A method for preparing a patterned feature includes the steps of I) casting a curable silicone composition against a master, II) curing the curable silicone composition to form a silicone mold, II) separating the master and the silicone mold, IV) filling a silicone mold having a patterned surface with a curable epoxy formulation; V) curing the curable epoxy formulation to form a patterned feature; VI) separating the silicone mold and the patterned feature; optionally VIII) etching the patterned feature; optionally IX) cleaning the silicone mold; and optionally X) repeating steps IV) to IX) reusing the silicone mold.
    Type: Application
    Filed: January 23, 2007
    Publication date: April 23, 2009
    Inventors: Wei Chen, Brian Robert Harkness, Sina Maghsoodi, James Steven Tonge
  • Publication number: 20080282495
    Abstract: An upright vacuum cleaner has a hose assembly (10, 10?) attached at one end to the base (1, 1?) of the cleaner. The hose assembly is stowed alongside the handle (6, 6?) and is retained by the free end (19) of the assembly engaging a fixture (21) on the handle. The hose assembly (10, 10?) comprises a rigid wand (12, 12?) and a flexible hose (11, 11?) with a natural extended length. The hose can be retracted to a shorter length using the power of the vacuum cleaner by closing a valve (20, 20?) on the wand (12, 12?) to prevent air flow along the hose assembly and produce a reduced pressure. The wand (12, 12?) is stowed by sliding inside or outside the hose (11, 11?) and has a flange (18, 18?) at one end that engages and seals with a flange (15, 15?) at the free end of the hose when the wand is extended.
    Type: Application
    Filed: January 27, 2005
    Publication date: November 20, 2008
    Applicant: Smiths Group plc
    Inventors: Philip Peter Battle, Diane Gibson, Derek Robert Harkness McGaw
  • Publication number: 20080277276
    Abstract: A method for preparing sensing devices (biosensors) includes the steps of: (1) applying a photopatternable silicone composition to a surface in a sensing device to form a film, (2) photopatterning the film by a process comprising exposing the film to radiation through a photomask without the use of a photoresist to produce an exposed film; (3) removing regions of the non-exposed film with a developing solvent to form a patterned film, which forms a permselective layer or an analyte attenuation layer covering preselected areas of the sensing device.
    Type: Application
    Filed: June 21, 2005
    Publication date: November 13, 2008
    Inventors: Geoffrey Bruce Gardner, Sina Maghsoodi, Brian Robert Harkness
  • Patent number: 6617674
    Abstract: A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: September 9, 2003
    Assignee: Dow Corning Corporation
    Inventors: Gregory Scott Becker, Geoffrey Bruce Gardner, Brian Robert Harkness, Louise Ann Malenfant, Satyendra Kumar Sarmah
  • Patent number: 6589776
    Abstract: Contaminated media is treated in a process which comprises adding at least one electron donor to contaminated media under anaerobic conditions to dehalogenate at least one halogen on at least one halogenated hydrocarbon in the presence of dehalogenating microorganisms wherein the electron donor comprises chitin, chitin-derivative, or combinations thereof.
    Type: Grant
    Filed: October 24, 2000
    Date of Patent: July 8, 2003
    Assignee: General Electric Company
    Inventor: Mark Robert Harkness
  • Publication number: 20030096090
    Abstract: Silicone resins comprising 5 to 50 mole % of (PhSiO(3-x)/2(OH)x) units and 50 to 95 mole % (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.
    Type: Application
    Filed: October 22, 2001
    Publication date: May 22, 2003
    Inventors: Ronald Paul Boisvert, Craig Rollin Yeakle, Stelian Grigoras, David Quocbinh Ha, Brian Robert Harkness
  • Publication number: 20020158317
    Abstract: A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepare by the method of the invention.
    Type: Application
    Filed: February 20, 2001
    Publication date: October 31, 2002
    Inventors: Gregory Scott Becker, Geoffrey Bruce Gardner, Brian Robert Harkness, Louise Ann Malenfant, Satyendra Kumar Sarmah
  • Publication number: 20020013974
    Abstract: A vacuum cleaner hose has a helical reinforcement and a compressible channel extending along the hose between the reinforcement. The channel is formed between two overlapping layers of flexible material bonded together where they extend over the reinforcement and unbonded where they extend between the reinforcement. Passages containing valves connect one end of the channel to the outlet of a vacuum cleaner pump and to its inlet so that air can be either supplied to the channel to extend the hose or withdrawn from the channel to retract the hose.
    Type: Application
    Filed: July 26, 2001
    Publication date: February 7, 2002
    Inventors: Diane Gibson, Derek Robert Harkness McGaw
  • Patent number: 6043341
    Abstract: The present invention provides phosphonylating agents and phosphonylation conditions that are compatible with the acid- and base-sensitive compounds and which promote a regioselective and reproducible conversion to a phosphonate compound. Also provided are intermediates that may be used to prepare phosphonate derivatives of cyclic peptides antifungal agent and a process for converting the phosphonates to the desired phosphonic acid prodrugs.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: March 28, 2000
    Assignee: Eli Lilly & Co.
    Inventors: Uko Effiong Udodong, John Leo Grutsch, Jr., Marvin Martin Hansen, Allen Robert Harkness, Daniel Edward Verral, II
  • Patent number: 5919298
    Abstract: A method for the preparation of hydrophobic fumed silicas which are useful, for example, as reinforcing fillers in rubber compositions. The method comprises two steps, where in the first step an aqueous suspension of fumed silica is contacted with an organosilicon compound in the presence of a catalytic amount of an acid to effect hydrophobing of the fumed silica. In the preferred method the first step is conducted in the presence of a water miscible organic solvent which facilitates hydrophobing of the fumed silica with the organosilicon compound and the fumed silica has a BET surface area greater than 50 m.sup.2 /g. In the second step the aqueous suspension of the fumed silica is contacted with a water-immiscible organic solvent at a solvent to silica weight ratio greater than 0.1:1 to effect separation of the hydrophobic fumed silica from the aqueous phase. In a preferred process the hydrophobic fumed silica has a surface area within a range of about 100 m.sup.2 /g to 750 m.sup.2 /g.
    Type: Grant
    Filed: January 12, 1998
    Date of Patent: July 6, 1999
    Assignee: Dow Corning Corporation
    Inventors: Phillip Joseph Griffith, William Herron, Brian Robert Harkness, Rosemary Margaret Taylor, David James Wilson
  • Patent number: 5891529
    Abstract: Curable compositions comprising a substance that produces a base when exposed to radiation and a polymer molecule that contains silicon-hydrogen bonds which react with hydroxyl groups under the action of the base to form silicon-oxygen bonds (Si--O) and hydrogen molecules. These compositions cure when exposed to radiation. A pattern can be formed by placing a mask between a coating of the composition and the radiation source during this exposure episode and thereafter dissolving the uncured composition. The compositions have little weight loss during their cure, they can be cured by low intensity radiation, and they yield heat-resistant cured products.
    Type: Grant
    Filed: May 18, 1998
    Date of Patent: April 6, 1999
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian Robert Harkness, Mamoru Tachikawa
  • Patent number: 5861468
    Abstract: A curable polysiloxane of formulaA.sub.a B.sub.b (R.sub.3 SiO.sub.0.5).sub.c (R.sub.2 SiO).sub.d (RSiO.sub.1.5).sub.e (SiO.sub.2).sub.fwhere A and B are silacyclobutane, disilacyclobutane or benzosilacyclobutene functional groups. A composition of matter comprising this polysiloxane and a copper, silver or gold containing catalyst. A method of curing this polysiloxane.
    Type: Grant
    Filed: December 1, 1995
    Date of Patent: January 19, 1999
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian Robert Harkness, Mamoru Tachikawa, Kasumi Takeuchi
  • Patent number: 5789460
    Abstract: Curable compositions comprising a substance that produces a base when exposed to radiation and a polymer molecule that contains silicon-hydrogen bonds which react with hydroxyl groups under the action of the base to form silicon-oxygen bonds (Si--O) and hydrogen molecules. These compositions cure when exposed to radiation. A pattern can be formed by placing a mask between a coating of the composition and the radiation source during this exposure episode and thereafter dissolving the uncured composition. The compositions have little weight loss during their cure, they can be cured by low intensity radiation, and they yield heat-resistant cured products.
    Type: Grant
    Filed: January 24, 1996
    Date of Patent: August 4, 1998
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Brian Robert Harkness, Mamoru Tachikawa
  • Patent number: PP10478
    Abstract: A new plant variety of Floribunda rose suitable for garden decoration, having flowers of yellow gold coloration.
    Type: Grant
    Filed: October 22, 1996
    Date of Patent: July 7, 1998
    Assignee: Weeks Wholesale Rose Grower, Inc.
    Inventor: Robert Harkness
  • Patent number: PP22587
    Abstract: A new variety of Floribunda rose suitable for garden decoration, having flowers of mango, peach & apricot blend coloration.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: March 20, 2012
    Assignee: Weeks Wholesale Rose Grower, Inc.
    Inventors: Robert Harkness, Philip Harkness