Abstract: A semiconductor device and a method of producing the semiconductor device are described. The semiconductor device includes: a semiconductor substrate; a metallization layer over the semiconductor substrate; a plating over the metallization layer, the plating including NiP; a passivation over the metallization layer and laterally adjacent the plating such that a surface of the plating that faces away from the semiconductor substrate is uncovered by the passivation, wherein a seam is present along an interface between the passivation and the plating; and a structure that covers the seam along a periphery of the plating and delimits a bondable area for the plating. The structure extends from the periphery of the plating onto the passivation. The structure includes an imide having a curing temperature below a recrystallization temperature of the NiP or an oxide having a deposition temperature below the recrystallization temperature of the NiP.

Abstract: According to various embodiments, a method for processing a semiconductor region, wherein the semiconductor region comprises at least one precipitate, may include: forming a precipitate removal layer over the semiconductor region, wherein the precipitate removal layer may define an absorption temperature at which a chemical solubility of a constituent of the at least one precipitate is greater in the precipitate removal layer than in the semiconductor region; and heating the at least one precipitate above the absorption temperature.

Abstract: According to various embodiments, a method for processing a semiconductor region, wherein the semiconductor region comprises at least one precipitate, may include: forming a precipitate removal layer over the semiconductor region, wherein the precipitate removal layer may define an absorption temperature at which a chemical solubility of a constituent of the at least one precipitate is greater in the precipitate removal layer than in the semiconductor region; and heating the at least one precipitate above the absorption temperature.

Abstract: A method and a system for determining the observability of faults in an electronic circuit include a processor that simulates, in a simulation phase, a behavior of the electronic circuit using a simulation model, and that determined, in an analysis phase, based on the simulation, and for each of a plurality of elements of the electronic circuit, time periods in which an occurrent fault could cause a deviation in analysis output signals, where the occurrent fault is determined not to cause any deviation in output signals in other time periods.

Abstract: A method and a system are presented for determining the observability of faults in an electronic circuit. In the method, for each element the time periods are determined in which an occurrent fault could cause a deviation in analysis output signals.

Abstract: A wheel cover for a vehicle wheel has a holding device which is activated by a lateral pressing-on of the appropriately position wheel cover, to fix the wheel cover on the wheel body. The holding device is deactivated by another pressing-on of the wheel cover in the same direction, so that the wheel cover can then easily be removed from the wheel body. For this purpose, the holding device includes a connecting link path as well as a detent pin guided therein during the mounting of the wheel cover. During mounting of the wheel cover on the wheel body, the free end of the detent pin is guided in the connecting link path such that, a first pressing-on of the wheel cover causes it to arrive in a detent position in the connecting link path, while a second pressing-on changes it out of the detent position, into a connecting link path section by way of which the detent pin can be guided out of the connecting link path. The wheel cover can preferably be pressed onto the wheel body against a spring force.

Abstract: The invention relates to a cover plate for a vehicle wheel having a holding device which is activated by a lateral pressing-on of the appropriately position cover plate and thereby fixes the cover plate on the wheel body, in which case the holding device is deactivated by another pressing-on of the cover plate in the same direction, sot hat the cover plate can then easily be removed from the wheel body. Elements of the holding device are preferably a connecting link path as well as a detent pin guided therein during the mounting of the cover plate.