Patents by Inventor Robert Heistand, II
Robert Heistand, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9666366Abstract: Improved method steps for making a multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrodes and insulating substrates are provided in an interleaved arrangement and selected portions of the electrodes are exposed along selected edges of the substrates. Anchor tabs, which are not in direct contact with the electrodes and offer additional nucleation points for plated structures, may also optionally be provided and exposed in some embodiments.Type: GrantFiled: September 28, 2004Date of Patent: May 30, 2017Assignee: AVX CorporationInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru
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Patent number: 9627132Abstract: Improved method steps for making a multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrodes and insulating substrates are provided in an interleaved arrangement and selected portions of the electrodes are exposed along selected edges of the substrates. Anchor tabs, which are not in direct contact with the electrodes and offer additional nucleation points for plated structures, may also optionally be provided and exposed in some embodiments.Type: GrantFiled: September 28, 2004Date of Patent: April 18, 2017Assignee: AVX CorporationInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru
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Publication number: 20130240366Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.Type: ApplicationFiled: March 15, 2013Publication date: September 19, 2013Applicant: AVX CORPORATIONInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru
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Patent number: 7576968Abstract: A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups. Each exposed portion is within a predetermined distance from other exposed portions in a given group such that termination structures may be formed by deposition and controlled bridging of a thin-film plated material among selected of the exposed internal conductive elements. Electrolytic plating may be employed in conjunction with optional cleaning and annealing steps to form directly plated portions of copper, nickel or other conductive material. Once an initial thin-film metal is directly plated to a component periphery, additional portions of different materials may be plated thereon.Type: GrantFiled: August 10, 2006Date of Patent: August 18, 2009Assignee: AVX CorporationInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, John M. Hulik, Raymond T. Galasco
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Patent number: 7344981Abstract: A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and/or bottom surfaces of the device.Type: GrantFiled: February 25, 2005Date of Patent: March 18, 2008Assignee: AVX CorporationInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru, Jeffrey A. Horn, Richard A. Ladew
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Patent number: 7263764Abstract: A method for adjusting the equivalent series resistance (ESR) of a multi-layer component includes providing at least first and second layers separated by an insulating layer, providing a resistive layer between the inslulating layer and one of the first or second electrode layers, and adjusting the ESR of the component by varying the effective resistance of the resistive layer. The effective resistance may be varied by adjusting the composition or thickness of the resistive layer. Alternatively, the effective resistance may be varied by forming a plurality of through-holes perforating one of the electrode layers and by then adjusting the respective diameters of selected of the through-holes to vary the extent of coverage on the resistive layer. An additionally disclosed feature of the present subject matter is to incorporate dielectric layers of varied thicknesses to broaden the resonancy curve associated with a particular mutli-layer component configuration.Type: GrantFiled: August 26, 2003Date of Patent: September 4, 2007Assignee: AVX CorporationInventors: Robert Heistand, II, John L. Galvagni, Georghe Korony
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Patent number: 7177137Abstract: A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and/or bottom surfaces of the device.Type: GrantFiled: April 6, 2004Date of Patent: February 13, 2007Assignee: AVX CorporationInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru, Jeffrey A. Horn, Richard A. Ladew
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Patent number: 7161794Abstract: Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such plated termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed varying width internal electrode tabs and additional anchor tab portions. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. The combination of electrode tabs and anchor tabs may be exposed in respective arrangements to form generally discoidal portions of plated material.Type: GrantFiled: July 28, 2004Date of Patent: January 9, 2007Assignee: AVX CorporationInventors: John L. Galvagni, Jason MacNeal, Andrew P. Ritter, Robert Heistand, II, Sriram Dattaguru
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Patent number: 7152291Abstract: Improved method steps for terminating multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrode and dielectric layers are provided in an interleaved arrangement and selected portions of the electrode layers are exposed. Electrically isolated anchor tabs may optionally be provided and exposed in some embodiments. Termination material is then plated to the exposed portions of the electrode layers until exposed portions of selected such portions thereof are connected. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.Type: GrantFiled: April 8, 2003Date of Patent: December 26, 2006Assignee: AVX CorporationInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru
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Patent number: 7154374Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.Type: GrantFiled: June 1, 2004Date of Patent: December 26, 2006Assignee: AVX CorporationInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru
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Patent number: 7067172Abstract: Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such plated termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed varying width internal electrode tabs and additional anchor tab portions. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. The combination of electrode tabs and anchor tabs may be exposed in respective arrangements to form generally discoidal portions of plated material.Type: GrantFiled: April 22, 2004Date of Patent: June 27, 2006Assignee: AVX CorporationInventors: Andrew P. Ritter, John L. Galvagni, Jason MacNeal, Robert Heistand, II, Sriram Dattaguru
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Patent number: 6982863Abstract: Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such plated termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed varying width internal electrode tabs and additional anchor tab portions. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. The combination of electrode tabs and anchor tabs may be exposed in respective arrangements to form generally discoidal portions of plated material.Type: GrantFiled: April 8, 2003Date of Patent: January 3, 2006Assignee: AVX CorporationInventors: John L. Galvagni, Jason MacNeal, Andrew P. Ritter, Robert Heistand, II, Sriram Dattaguru
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Patent number: 6972942Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations.Type: GrantFiled: June 1, 2004Date of Patent: December 6, 2005Assignee: AVX CorporationInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru
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Patent number: 6960366Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations.Type: GrantFiled: August 1, 2003Date of Patent: November 1, 2005Assignee: AVX CorporationInventors: Andrew P. Ritter, Robert Heistand, II, John L. Galvagni, Sriram Dattaguru
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Patent number: 6757152Abstract: Multi-layer and cascade capacitors for use in high frequency applications and other environments are disclosed. The subject capacitor may have multiple capacitor components or aspects thereof in an integrated package. Such components may include, for example, thin film BGA components, interdigitated capacitor (IDC) configurations, double-layer electrochemical capacitors, surface mount tantalum products, multilayer capacitors, single layer capacitors, and others. Exemplary embodiments of the present subject matter preferably encompass at least certain aspects of thin film BGA techniques and/or IDC-style configurations. Features for attachment and interconnection are provided that facilitate low ESL while maintaining a given capacitance value. Additional advantages include low ESR and decoupling performance over a broad band of operational frequencies.Type: GrantFiled: September 4, 2002Date of Patent: June 29, 2004Assignee: AVX CorporationInventors: John L. Galvagni, Robert Heistand, II, Georghe Korony