Abstract: A rectifier circuit for a power supply includes a diode bridge, a first metal-oxide-semiconductor field-effect transistor (MOSFET) and a second MOSFET each coupled in parallel with corresponding diodes of the diode bridge to reduce losses associated with bridge diode voltage drops and increase conversion efficiency. A self-driven driver circuit is coupled for controlling switching operation of the first MOSFET and the second MOSFET to operate the first MOSFET and the second MOSFET as high-side floating synchronous rectifiers. Methods of supplying power via a rectifier circuit of a power supply are also described.

Abstract: According to some aspects of the present disclosure, heat sink assemblies are disclosed. Example heat sink assemblies include a printed circuit board having a first side and a second side. The printed circuit board defines an opening extending from the first side to the second side. The heat sink assembly also includes a heat sink coupled to the first side of the printed circuit board. The heat sink includes a protrusion extending through the through opening of the printed circuit board. The heat sink assembly further includes a surface mounted device coupled to the second side of the printed circuit board. The surface mounted device is in thermal contact with the protrusion of the heat sink to transfer heat from the surface mounted device to the heat sink. Example methods of manufacturing heat sink assemblies are also disclosed.

Abstract: According to some aspects of the present disclosure, heat sink assemblies are disclosed. Example heat sink assemblies include a printed circuit board having a first side and a second side. The printed circuit board defines an opening extending from the first side to the second side. The heat sink assembly also includes a heat sink coupled to the first side of the printed circuit board. The heat sink includes a protrusion extending through the through opening of the printed circuit board. The heat sink assembly further includes a surface mounted device coupled to the second side of the printed circuit board. The surface mounted device is in thermal contact with the protrusion of the heat sink to transfer heat from the surface mounted device to the heat sink. Example methods of manufacturing heat sink assemblies are also disclosed.

Abstract: A power supply includes an input terminal, an output terminal, a DC voltage regulator coupled between the input terminal and the output terminal to provide a substantially constant DC output voltage at the output terminal, a voltage divider coupled between the output terminal and ground (e.g., earth ground or another suitable reference potential), the voltage divider including at least a first resistance, a second resistance and a first node between the first resistance and the second resistance, the first node coupled to the DC voltage regulator to provide a feedback voltage to the DC voltage regulator for regulating the DC output voltage, and an adjustable shunt regulator coupled between the output terminal and the first node.

Abstract: A power supply includes an input terminal, an output terminal, a DC voltage regulator coupled between the input terminal and the output terminal to provide a substantially constant DC output voltage at the output terminal, a voltage divider coupled between the output terminal and ground (e.g., earth ground or another suitable reference potential), the voltage divider including at least a first resistance, a second resistance and a first node between the first resistance and the second resistance, the first node coupled to the DC voltage regulator to provide a feedback voltage to the DC voltage regulator for regulating the DC output voltage, and an adjustable shunt regulator coupled between the output terminal and the first node.