Abstract: A method for removing pollutants from flue gas generated by a plant having one or more burners located at an inlet end of a vertically extending stack, the flue gas being discharged through an outlet end of the stack. The pollutants are removed by an emission treatment system which includes a major component module and inlet and outlet ductwork providing fluid communications between the stack and the major component module. The major component module includes an SCR segment, a heat exchanger segment, and an ID fan, the SCR segment having at least one catalyst unit composed of materials for selectively catalyzing at least one pollutant. The method comprises the steps of drawing the flue gas from the stack and through the major component module with the ID fan, removing the pollutant from the flue gas with the SCR segment to produce a clean flue gas, and discharging the clean flue gas to the stack with the ID fan.

Abstract: A cooler device includes an elongate housing for receiving canned drinks. A lid is selectively secured by a catch mechanism for enclosing an open top end of the housing in a closed position of the lid. The housing has an external surface configured to have the appearance of an animal, with the lid being concealed within the external surface of the housing to provide an entertaining and finished appearance to the cooler device. The catch mechanism is also concealed by the external surface of the housing by forming a release button of the catch mechanism to be a facial feature of the animal which decorates the external surface of the housing.

Abstract: A probing system or process for electrical testing of a device fabricated on a wafer also conditions terminals such as solder balls on the device to improve uniformity of the heights of the terminals and improve the reliability of connections to an interconnect substrate in a flip-chip package or to a printed circuit board in a chip-on-board application. The system can employ a probe card that is a printed circuit board and/or is substantially identical to interconnect substrates used in flip-chip packaging. The probe card can be replaceable on a test head to allow for quick changes the reduce ATE downtime and to accommodate device changes such as a die shrink. Probe tips on the probe card can be the contact pads or bumps that are the normal electrical contact structures of the interconnect substrates.

Abstract: A one-piece interconnection structure (10) for an SO package (60) is formed from a single sheet strip (12) of copper having a thickness of about 8 mils. Contact finger patterns (14) are formed from a plurality of contact fingers (22) which extend in cantilever fashion. The fingers (22) have tips (24) of a reduced thickness of between about 2-3 mils. Stress relief slots (26) having a depth of about 2 mils are formed in the underside of each finger (22) spaced back from the tips (24) to give the fingers increased flexibility for downward bending during assembly operations. Vertical slots (28) on opposing sides of the fingers behind the stress relief slots give increased lateral flexibility to the fingers. Steps (30) extend vertically along the lateral fingers (22) and have two surfaces (32 and 34) angularly disposed with respect to central surface (36) on the top and bottom fingers.