Patents by Inventor Robert Horning

Robert Horning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240140915
    Abstract: Disclosed are compounds of Formula (I): or pharmaceutically acceptable salts or solvates thereof, wherein R1, R3, X, Y, Z, and W are as defined herein. The compounds are, for example, inhibitors of WRN helicase and useful in treating a proliferative disease, such as cancer.
    Type: Application
    Filed: September 20, 2023
    Publication date: May 2, 2024
    Inventors: Shota Kikuchi, Betty Lam, Jason Green, Don Rogness, David Weinstein, Larry Burgess, Benjamin Horning, Kelsey Lamb, Zachary Owyang, Robert Malmstrom
  • Publication number: 20240127698
    Abstract: Provided is a method of transportation information exchange that includes receiving first data from a first aviation data source, such that the first data is provided in a first data format type and determining, based on a set of routing rules, a first aviation consumer of at least a first portion of the first data. The method further includes processing the first portion of the first data into a second data format type associated with the first aviation consumer and providing the first portion of the first data in the second data format type to the first aviation consumer.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 18, 2024
    Inventors: John Stephen Eberhardt, III, Matthew Joseph Scott Drew, Eric Shofstall Kucks, Boris Stanimirov Boiko, Andrew Scott Beals, Mitchell Robert Horning
  • Publication number: 20240079228
    Abstract: A low loss silicon nitride film is formed by depositing a silicon nitride film on a substrate and annealing the silicon nitride film for at least ten hours at a temperature of at least 400° C. to cause the silicon nitride film to become a low loss silicon nitride film. The low loss silicon nitride film has an optical loss of less than 1 dB per cm at a wavelength of 488 nm.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 7, 2024
    Inventors: Christopher John Carron, Molly Krogstad, Robert Horning, Robert Higashi, David Deen
  • Patent number: 11922215
    Abstract: Systems and methods for purposeful computing are disclosed that, among other things, include a user purpose class resource information computing environment. Such environment supports resource purpose classes, and further supports resource identification information sets that characterize their respective subject matter resources. The computing environment can be used to identify and evaluate one or more purpose class subject matter resource members.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: March 5, 2024
    Assignee: Advanced Elemental Technologies, Inc.
    Inventors: Victor Henry Shear, Peter Robert Williams, Jaisook Rho, Timothy St. John Redmond, James Jay Horning
  • Publication number: 20240067612
    Abstract: Disclosed are compounds of Formula (I): or pharmaceutically acceptable salts or solvates thereof, wherein R1, R3, X, Y, Z, and W are as defined herein. The compounds are, for example, inhibitors of WRN helicase and useful in treating a proliferative disease, such as cancer.
    Type: Application
    Filed: July 5, 2023
    Publication date: February 29, 2024
    Inventors: Shota Kikuchi, Betty Lam, Jason Green, Don Rogness, David Weinstein, Larry Burgess, Benjamin Horning, Kelsey Lamb, Zach Owyang, Robert Malmstrom
  • Publication number: 20070018532
    Abstract: Methods for using ink-jet printing to deposit various layers of micro-structure devices are provided. A wide variety of micro-structures may be formed using these techniques including, for example, many forms of MEMs structures as well as other structures.
    Type: Application
    Filed: September 22, 2006
    Publication date: January 25, 2007
    Applicant: Honeywell International Inc.
    Inventors: Robert Horning, Thomas Ohnstein, Daniel Youngner
  • Patent number: 7112463
    Abstract: Methods for using ink-jet printing to deposit various layers of micro-structure devices are provided. A wide variety of micro-structures may be formed using these techniques including, for example, many forms of MEMs structures as well as other structures.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: September 26, 2006
    Assignee: Honeywell International Inc.
    Inventors: Robert Horning, Thomas Ohnstein, Daniel Youngner
  • Publication number: 20060201249
    Abstract: Methods of fabricating thinned comb MEMS devices are disclosed. A comb drive device in accordance with an illustrative embodiment of the present invention can include a number of interdigitated comb fingers some of which have a reduced thickness along at least a portion of their length relative to other comb fingers.
    Type: Application
    Filed: March 9, 2005
    Publication date: September 14, 2006
    Inventors: Robert Horning, Mark Weber, Burgess Johnson
  • Publication number: 20060154443
    Abstract: An approach where items of different temperatures are bonded to each other such that upon cooling down they contract in size resulting in zero residual stress between the bonded items at an ambient temperature. If materials of the bonded items have different thermal expansion coefficients and the items are put together at different bonding temperatures, then they may have insignificant residual stress upon cooling down to the ambient temperature (e.g., room temperature) because the different ranges of the temperature drops compensate for the different contractions.
    Type: Application
    Filed: January 7, 2005
    Publication date: July 13, 2006
    Inventor: Robert Horning
  • Publication number: 20060110854
    Abstract: A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.
    Type: Application
    Filed: December 30, 2005
    Publication date: May 25, 2006
    Inventors: Robert Horning, Jeffrey Ridley
  • Publication number: 20050104911
    Abstract: Methods for using ink-jet printing to deposit various layers of micro-structure devices are provided. A wide variety of micro-structures may be formed using these techniques including, for example, many forms of MEMs structures as well as other structures.
    Type: Application
    Filed: November 13, 2003
    Publication date: May 19, 2005
    Inventors: Robert Horning, Thomas Ohnstein, Daniel Youngner
  • Publication number: 20050099254
    Abstract: An elongated robotic member that is simple in design and structure, relatively inexpensive and consumes little power. In one illustrative embodiment, one or more linear actuators are used in conjunction with two or more plates that are fixed at spaced locations along a spine member. Fixed between each pair of plates is one or more actuators, which when activated, pull or push corresponding portions of the plates towards or away from each other. This changes the relative orientation of the plate pairs, thus providing a bending movement. The spine preferably is flexible at least in the lateral direction, and bends in response to the relative movement of the plates. A number of plate pairs may be provided to create an arbitrarily long robotic member.
    Type: Application
    Filed: November 12, 2003
    Publication date: May 12, 2005
    Inventors: Thomas Ohnstein, Daniel Youngner, Robert Horning
  • Publication number: 20050084998
    Abstract: A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.
    Type: Application
    Filed: October 21, 2003
    Publication date: April 21, 2005
    Inventors: Robert Horning, Jeffrey Ridley
  • Publication number: 20050067919
    Abstract: A microactuator device having at least a pair of polymeric sheets each having conductive and dielectric films deposited thereon, the polymeric sheets facing each other and bonded together to create at least one cell having a substantially circular shape parallel to a plane in which the polymeric sheets lie, the at least one cell having at least one egress hole to allow a fluid to pass there through when a source of electric potential is applied to the conductive films to cause a portion of the polymeric sheets in the vicinity of a perimeter of the cell to be attracted to one another and thereby cause the cell to retract or collapse upon itself.
    Type: Application
    Filed: September 30, 2003
    Publication date: March 31, 2005
    Inventor: Robert Horning
  • Publication number: 20050050971
    Abstract: A method for controlling bow in wafers which utilize doped layers is described. The method includes depositing a silicon-germanium layer onto a substrate, depositing an undoped buffer layer onto the silicon-germanium layer, and depositing a silicon-boron layer onto the undoped layer.
    Type: Application
    Filed: July 19, 2004
    Publication date: March 10, 2005
    Inventor: Robert Horning
  • Publication number: 20040145277
    Abstract: A microactuator device is disclosed that includes a plurality of generally parallel thin flexible sheets bonded together in a predetermined pattern to form an array of unit cells. Preferably, each of the sheets has only a single electrode layer located on one side of the sheet. Pairs of such sheets are then bonded together at spaced bonding locations with the electrode layers facing one another. Several sets of such sheet pairs can then be bonded together to form a microactuator device.
    Type: Application
    Filed: January 5, 2004
    Publication date: July 29, 2004
    Inventors: Robert Horning, Burgess Johnson
  • Patent number: 6684469
    Abstract: A method of manufacturing a microactuator device includes a plurality of generally parallel thin flexible sheets bonded together in a predetermined pattern to form an array of unit cells. Preferably, each of the sheets has only a single electrode layer located on one side of the sheet. Pairs of such sheets are then bonded together at spaced bonding locations with the electrode layers facing one another. Several sets of such sheet pairs can then be bonded together to form a microactuator device.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: February 3, 2004
    Assignee: Honeywell International Inc.
    Inventors: Robert Horning, Burgess Johnson
  • Patent number: 6646364
    Abstract: A microactuator device is disclosed that includes a plurality of generally parallel thin flexible sheets bonded together in a predetermined pattern to form an array of unit cells. Preferably, each of the sheets has only a single electrode layer located on one side of the sheet. Pairs of such sheets are then bonded together at spaced bonding locations with the electrode layers facing one another. Several sets of such sheet pairs can then be bonded together to form a microactuator device.
    Type: Grant
    Filed: July 11, 2000
    Date of Patent: November 11, 2003
    Assignee: Honeywell International Inc.
    Inventors: Robert Horning, Burgess Johnson
  • Publication number: 20020125790
    Abstract: A microactuator device is disclosed that includes a plurality of generally parallel thin flexible sheets bonded together in a predetermined pattern to form an array of unit cells. Preferably, each of the sheets has only a single electrode layer located on one side of the sheet. Pairs of such sheets are then bonded together at spaced bonding locations with the electrode layers facing one another. Several sets of such sheet pairs can then be bonded together to form a microactuator device.
    Type: Application
    Filed: February 15, 2002
    Publication date: September 12, 2002
    Inventors: Robert Horning, Burgess Johnson