Patents by Inventor Robert I. Greene
Robert I. Greene has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11692268Abstract: Embodiments of a gas distribution plate for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. At least one of the gas passages has a cylindrical shape for a portion of its length extending from the upstream side and a coaxial conical shape for the remainder length of the diffuser plate, the upstream end of the conical portion having substantially the same diameter as the cylindrical portion and the downstream end of the conical portion having a larger diameter.Type: GrantFiled: April 24, 2014Date of Patent: July 4, 2023Assignee: Applied Materials, Inc.Inventors: Soo Young Choi, John M. White, Robert I. Greene
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Publication number: 20140230730Abstract: Embodiments of a gas distribution plate for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. At least one of the gas passages has a cylindrical shape for a portion of its length extending from the upstream side and a coaxial conical shape for the remainder length of the diffuser plate, the upstream end of the conical portion having substantially the same diameter as the cylindrical portion and the downstream end of the conical portion having a larger diameter.Type: ApplicationFiled: April 24, 2014Publication date: August 21, 2014Inventors: Soo Young CHOI, John M. WHITE, Robert I. GREENE
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Patent number: 8795793Abstract: Embodiments of a gas distribution plate for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. At least one of the gas passages has a right cylindrical shape for a portion of its length extending from the upstream side and a coaxial conical shape for the remainder length of the diffuser plate, the upstream end of the conical portion having substantially the same diameter as the right cylindrical portion and the downstream end of the conical portion having a larger diameter. The gas distribution plate is relatively easy to manufacture and provides good chamber cleaning rate, good thin film deposition uniformity and good thin film deposition rate.Type: GrantFiled: October 20, 2008Date of Patent: August 5, 2014Assignee: Applied Materials, Inc.Inventors: Soo Young Choi, John M. White, Robert I. Greene
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Patent number: 7732010Abstract: A method for supporting a glass substrate comprising providing a substrate support having an aluminum body, a substrate contact area formed on the surface of the substrate support, wherein the process of forming the substrate contact area comprises forming an anodization layer on a surface region of the aluminum body, the coating having a thickness of between about 0.3 mils and about 2.16 mils, wherein the surface region substantially corresponds to the substrate contact area, and preparing the anodization layer disposed over the surface region to a surface roughness between about 88 micro-inches and about 230 micro-inches, followed by anodizing the substrate surface to said thickness, positioning the substrate support adjacent a substrate processing region in a substrate processing chamber, wherein the substrate contact area is adjacent the substrate processing region, positioning the glass substrate on the substrate contact area.Type: GrantFiled: April 18, 2006Date of Patent: June 8, 2010Assignee: Applied Materials, Inc.Inventors: Soo Young Choi, Beom Soo Park, Quanyuan Shang, Robert I. Greene, John M. White, Dong-Kil Yim, Chung-Hee Park, Kam Law
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Publication number: 20090104376Abstract: Embodiments of a gas distribution plate for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. At least one of the gas passages has a right cylindrical shape for a portion of its length extending from the upstream side and a coaxial conical shape for the remainder length of the diffuser plate, the upstream end of the conical portion having substantially the same diameter as the right cylindrical portion and the downstream end of the conical portion having a larger diameter. The gas distribution plate is relatively easy to manufacture and provides good chamber cleaning rate, good thin film deposition uniformity and good thin film deposition rate.Type: ApplicationFiled: October 20, 2008Publication date: April 23, 2009Inventors: SOO YOUNG CHOI, John M. White, Robert I. Greene
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Patent number: 6942753Abstract: Embodiments of a gas distribution plate for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution plate includes a diffuser plate having a plurality of gas passages passing between an upstream side and a downstream side of the diffuser plate. At least one of the gas passages includes a first hole and a second hole coupled by an orifice hole. The first hole extends from the upstream side of the diffuser plate while the second hole extends from the downstream side. The orifice hole has a diameter less than the respective diameters of the first and second holes.Type: GrantFiled: April 16, 2003Date of Patent: September 13, 2005Assignee: Applied Materials, Inc.Inventors: Soo Young Choi, Quanyuan Shang, Robert I. Greene, Li Hou
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Patent number: 6863077Abstract: A system for processing substrates within a chamber and for cleaning accumulated material from chamber components is provided. The system includes a reactive species generator adapted to generate a reactive gas species for chemically etching accumulated material from chamber components, and a processing chamber having at least one component with a mirror polished surface which is exposed to the reactive species. Preferably to have the greatest impact on chamber cleaning efficiency, the mirror polished surface is a surface of a component such as a gas distribution plate or a backing plate, and/or is a surface of a plurality of smaller components (e.g., chamber wall liners, a gas conductance line, etc.) so as to constitute a large percentage of the surface area exposed to the reactive species. Most preferably all bare aluminum surfaces which the reactive species contacts are mirror polished.Type: GrantFiled: July 15, 2002Date of Patent: March 8, 2005Assignee: Applied Materials, Inc.Inventors: Sheng Sun, Quanyuan Shang, William R. Harshbarger, Robert I. Greene
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Publication number: 20040221959Abstract: A substrate support and method for fabricating the same are provided. In one embodiment of the invention, a substrate support includes an electrically conductive body having a substrate support surface that is covered by an electrically insulative coating. At least a portion of the coating centered on the substrate support surface has a surface finish of between about 80 to about 200 micro-inches. In another embodiment, a substrate support includes an anodized aluminum body having a surface finish on the portion of the body adapted to support a substrate thereon of between about 80 to about 200 micro-inches.Type: ApplicationFiled: May 9, 2003Publication date: November 11, 2004Applicant: Applied Materials, Inc.Inventors: Soo Young Choi, Beom Soo Park, Quanyuan Shang, Robert I. Greene, John M. White, Dong-Kil Yim, Chung-Hee Park, Kam Law
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Publication number: 20040206305Abstract: Embodiments of a gas distribution plate for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution plate includes a diffuser plate having a plurality of gas passages passing between an upstream side and a downstream side of the diffuser plate. At least one of the gas passages includes a first hole and a second hole coupled by an orifice hole. The first hole extends from the upstream side of the diffuser plate while the second hole extends from the downstream side. The orifice hole has a diameter less than the respective diameters of the first and second holes.Type: ApplicationFiled: April 16, 2003Publication date: October 21, 2004Applicant: Applied Materials, Inc.Inventors: Soo Young Choi, Quanyuan Shang, Robert I. Greene, Li Hou
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Publication number: 20040096636Abstract: A method for lifting a substrate from a susceptor. A plurality of lift pins is configured so that they support the substrate without contacting a central portion of the substrate. The processed substrate has a first dimension that is at least 500 millimeters and a second dimension that is at least 500 millimeters. Each lift pin in the plurality of lift pins is configured so that it supports the substrate from a point that is at least 120 millimeters from a center of the substrate. The plurality of lift pins is configured so that each side of the susceptor is supported by at least three lift pins. In some embodiments, a support member overlies at least a subset of the plurality of lift pins.Type: ApplicationFiled: November 18, 2002Publication date: May 20, 2004Applicant: Applied Materials, Inc.Inventors: Li Hou, Quanyuan Shang, Robert I. Greene
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Publication number: 20040089239Abstract: A substrate support assembly and method for dechucking a substrate is provided. In one embodiment, a support assembly includes a substrate support having a support surface, a first set of lift pins and one or more other lift pins movably disposed through the substrate support. The first set of lift pins and the one or more lift pins project from the support surface when the pins are in an actuated position. When in the actuated position, the first set of lift pins project a longer distance from the support surface than the one or more other lift pins. In another aspect of the invention, a method for dechucking a substrate from a substrate support is provided. In one embodiment, the method includes the steps of projecting a first set of lift pins a first distance above a surface of a substrate support, and projecting a second set of lift pins a second distance above the surface of the substrate support that is less than the first distance.Type: ApplicationFiled: October 17, 2003Publication date: May 13, 2004Applicant: Applied Materials, Inc.Inventors: Quanyuan Shang, William R. Harshbarger, Robert I. Greene, Ichiro Shimizu
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Publication number: 20030203123Abstract: A cluster tool for forming a poly-Si layer on a substrate comprises (i) a first chamber for depositing silicon onto the substrate to form an a-Si layer on the substrate, (ii) a second chamber for depositing onto the a-Si layer a metal that is capable of inducing nucleation sites in a-Si, and (iii) a third chamber for annealing the &agr;-Si layer, thereby forming the poly-Si layer on the substrate. In one embodiment, the second chamber is a plasma enhanced chemical vapor deposition (PECVD) reactor that includes an upper electrode. An outer surface of the upper electrode is made of a metal that is capable of inducing the nucleation sites. In this embodiment, the metal is deposited onto the substrate from the upper electrode when a plasma is generated between the upper electrode and a lower electrode in the PECVD reactor, thereby causing deposition of the metal onto the substrate.Type: ApplicationFiled: April 26, 2002Publication date: October 30, 2003Applicant: Applied Materials, Inc.Inventors: Quanyaun Shang, Fan Cheung Sze, Robert I. Greene, Janine Kardokus, Beom Soo Park, Soo Young Choi, Tae Kyung Won, Qunhua Wang, William R. Harshbarger
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Publication number: 20030079691Abstract: A substrate support assembly and method for dechucking a substrate is provided. In one embodiment, a support assembly includes a substrate support having a support surface, a first set of lift pins and one or more other lift pins movably disposed through the substrate support. The first set of lift pins and the one or more lift pins project from the support surface when the pins are in an actuated position. When in the actuated position, the first set of lift pins project a longer distance from the support surface than the one or more other lift pins. In another aspect of the invention, a method for dechucking a substrate from a substrate support is provided. In one embodiment, the method includes the steps of projecting a first set of lift pins a first distance above a surface of a substrate support, and projecting a second set of lift pins a second distance above the surface of the substrate support that is less than the first distance.Type: ApplicationFiled: December 2, 2002Publication date: May 1, 2003Applicant: Applied Materials, Inc.Inventors: Quanyuan Shang, William R. Harshbarger, Robert I. Greene, Ichiro Shimizu
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Publication number: 20020174885Abstract: A system for processing substrates within a chamber and for cleaning accumulated material from chamber components is provided. The system includes a reactive species generator adapted to generate a reactive gas species for chemically etching accumulated material from chamber components, and a processing chamber having at least one component with a mirror polished surface which is exposed to the reactive species. Preferably to have the greatest impact on chamber cleaning efficiency, the mirror polished surface is a surface of a component such as a gas distribution plate or a backing plate, and/or is a surface of a plurality of smaller components (e.g., chamber wall liners, a gas conductance line, etc.) so as to constitute a large percentage of the surface area exposed to the reactive species. Most preferably all bare aluminum surfaces which the reactive species contacts are mirror polished.Type: ApplicationFiled: July 15, 2002Publication date: November 28, 2002Inventors: Sheng Sun, Quanyuan Shang, William R. Harshbarger, Robert I. Greene
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Patent number: 6432255Abstract: A system for processing substrates within a chamber and for cleaning accumulated material from chamber components is provided. The system includes a reactive species generator adapted to generate a reactive gas species for chemically etching accumulated material from chamber components, and a processing chamber having at least one component with a mirror polished surface which is exposed to the reactive species. Preferably to have the greatest impact on chamber cleaning efficiency, the mirror polished surface is a surface of a component such as a gas distribution plate or a backing plate, and/or is a surface of a plurality of smaller components (e.g., chamber wall liners, a gas conductance line, etc.) so as to constitute a large percentage of the surface area exposed to the reactive species. Most preferably all bare aluminum surfaces which the reactive species contacts are mirror polished.Type: GrantFiled: January 31, 2000Date of Patent: August 13, 2002Assignee: Applied Materials, Inc.Inventors: Sheng Sun, Quanyuan Shang, William R. Harshbarger, Robert I. Greene
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Publication number: 20020083897Abstract: Embodiments of the invention generally provides an apparatus and a method for minimizing the deformation of a substrate during PECVD processing. In one aspect, the substrate is supported within a processing region on an insulating layer to provide uniform heating of the substrate.Type: ApplicationFiled: December 18, 2001Publication date: July 4, 2002Applicant: APPLIED MATERIALS, INC.Inventors: Quanyuan Shang, Robert I. Greene, Li Hou
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Patent number: 6355108Abstract: The present invention relates generally to a clamping and alignment assembly for a substrate processing system. The clamping and aligning assembly generally includes a shadow frame, a floating plasma shield and a plurality of insulating alignment pins. The shadow frame comprises a plurality of tabs extending inwardly therefrom and is shaped to accommodate a substrate. The tabs comprise protruding contact surfaces for stabilizing a substrate on a support member during processing. The insulating alignment pins are disposed at a perimeter of a movable support member and cooperate with an alignment recess formed in the shadow frame to urge the shadow frame into a desired position. Preferably, the floating plasma shield is disposed on the insulating alignment pins in spaced relationship between the support member and the shadow frame to shield the perimeter of the support member during processing.Type: GrantFiled: June 22, 1999Date of Patent: March 12, 2002Assignee: Applied Komatsu Technology, Inc.Inventors: Tae Kyung Won, Quanyuan Shang, Robert M. Robertson, Soo Young Choi, Kam S. Law, Robert I. Greene, John M. White
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Patent number: 5621763Abstract: An apparatus and method generates a shaped transition between the minimum and maximum output power levels of a transmitter (500). When the transmitter is turned on a stepped transition (415) is generated at the beginning (3) of the transition region (409) followed by a shaped transition (417) to the end (6) of the transition region (409). When the transmitter (500) is turned off a shaped transition region (417') is generated at the beginning (162) of the transition region (411) followed by a stepped transition (415') at the end (3) of the transition region (411). The stepped transition (415 or 415') is generated by adjusting a voltage controlled attenuator (545) and the bias of a power amplifier (545) in the transmitter (500). The shaped transition (417 or 417') is generated by processing transmitted information through finite impulse response filters (507 or 509) before or after the time slot permitted for transmitting information.Type: GrantFiled: May 15, 1995Date of Patent: April 15, 1997Assignee: MotorolaInventors: Thomas J. Walczak, Robert I. Greene, Stephen V. Cahill, John W. Diehl
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Patent number: 4077715Abstract: An automatically focusing optical system for copiers, duplicators and other reproduction equipment having a variable magnification capability. The auto-focusing mechanism comprises a camming means for moving a mirror or other component of the optical system to maintain focus throughout the magnification range of the system. The camming means is additionally designed to be adjustable in such a way that it can accommodate imaging lens systems which differ in focal length within the normal manufacturing tolerance band, and thus replace the family of cams utilized in the prior art to accommodate lenses of different focal length.Type: GrantFiled: February 18, 1977Date of Patent: March 7, 1978Assignee: Itek CorporationInventor: Robert I. Greene
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Patent number: 3954261Abstract: A transport mechanism is disclosed for driving inked paper emerging from the printing station of a duplicating machine into a stacking station, the transport mechanism employing a first pair of beveled drive rollers and a second pair of rounded rollers biased against the beveled drive rollers by gravity which prevents ink buildup upon the second pair of drive rollers where bleed edge inked paper is being transported through the system.Type: GrantFiled: January 3, 1975Date of Patent: May 4, 1976Assignee: Itek CorporationInventors: Robert I. Greene, Thomas M. Madigan