Patents by Inventor Robert J. Bahn

Robert J. Bahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless process for the preparation of particle enhanced electric contact surfaces
    Patent number: 6630203
    Abstract: The present invention provides a unique method for the electroless co-deposition of metal and hard particles on an electrical contact surface to provide electrical, thermal, and mechanical connections between the particle enhanced contact surface and an opposing contact surface, and to enhance the thermal and electrical conductivity between the contact surfaces and their corresponding substrates. The innovative method is able to uniformly deposit metal and particles of any shape, and with a wide range of density and sizes, on contact surfaces, and can be adjusted to provide any desired surface area coverage in desirable deposition patterns. The co-deposited contact surface can, for example, be easily joined to another surface of any type by nonconductive adhesive, resulting in a connection that is mechanically robust, chemically inert, and inherently electrically conductive.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: October 7, 2003
    Assignee: NanoPierce Technologies, Inc.
    Inventors: Robert J. Bahn, Fred A. Blum, Herbert J. Neuhaus, Bin Zou
  • Electroless process for the preparation of particle enhanced electric contact surfaces
    Publication number: 20020192363
    Abstract: The present invention provides a unique method for the electroless co-deposition of metal and hard particles on an electrical contact surface to provide electrical, thermal, and mechanical connections between the particle enhanced contact surface and an opposing contact surface, and to enhance the thermal and electrical conductivity between the contact surfaces and their corresponding substrates. The innovative method is able to uniformly deposit metal and particles of any shape, and with a wide range of density and sizes, on contact surfaces, and can be adjusted to provide any desired surface area coverage in desirable deposition patterns. The co-deposited contact surface can, for example, be easily joined to another surface of any type by nonconductive adhesive, resulting in a connection that is mechanically robust, chemically inert, and inherently electrically conductive.
    Type: Application
    Filed: June 15, 2001
    Publication date: December 19, 2002
    Inventors: Robert J. Bahn, Bin Zou, Herbert J. Neuhaus, Fred A. Blum