Abstract: The present invention is a wideband temperature-dependent attenuator. In a preferred embodiment the attenuator is a modified Tee attenuator having first and second resistors connected in series at a first node and third and fourth resistors connected in shunt between the first node and ground. In a physical implementation of the attenuator, the third and fourth resistors are on opposite sides of the first and second resistors. Preferably, each of the four resistors is formed as a thick film resistor.

Abstract: A preferred embodiment of the present invention comprises at least first and second thermistors, arranged into a classical Tee, Pi, or Bridged Tee attenuator design, a heating element, a temperature sensor, and a control circuit. The thermistors have different temperature coefficients of resistance and are in close proximity to the heating element and the temperature sensor. The control circuit receives a voltage signal from the temperature sensor, compares that signal with a voltage signal specifying a desired temperature, and applies electrical energy to the heating element until receiving a signal from the temperature sensor that the temperature of the thermistors matches the desired temperature. As a result, the attenuation of the attenuator can be changed at a controlled rate by varying the temperature of the thermistors, while the impedance of the attenuator remains within acceptable levels.

Abstract: A temperature and frequency variable gain attenuator comprises a temperature variable attenuator and a temperature variable filter network whose resistances changed to c generate different responses that vary over temperature and frequency. At least three different thick film thermistors are used, with two of these used on the attenuator and a third one used on the filter network. The temperature coefficients of the thermistors are different and are selected so that the attenuator and filter network attenuation change at a controlled rate with changes in temperature while the impedance of the gain equalizer remains within acceptable levels. Substantially any temperature coefficient of resistance can be created for each resistor by properly selecting and mixing different inks when forming the thick film thermistors. Furthermore, the attenuator can have either a negative temperature coefficient of attenuation or a positive temperature coefficient of attenuation.

Abstract: The present invention is an absorptive-type cable temperature and frequency equalizer that offsets changes in the gain of the other circuit components cables with increases in temperature and/or frequency. The equalizer comprises a temperature variable filter network having component values and a temperature coefficient of resistance that vary over temperature and frequency to produce a desired response. The temperature and frequency equalizer has at least one thick film thermistor connected in series with a quarter wavelength transmission line. The thermistor absorbs forward and reflected signals at lower frequencies.

Abstract: An absorptive temperature-variable microwave attenuator is produced using a first plurality of shunt resistors separated by quarter-wave transmission lines connected by a series resistor with a second plurality of shunt resistors separated by quarter-wave transmission lines. At least one or more of the resistors are temperature-variable resistors. The temperature coefficients of the temperature-variable resistors are selected so that the attenuator changes at a controlled rate with changes in temperature while attenuator remains relatively matched to the transmission line. In one embodiment, the resistors are thick-film resistors and a variety of temperature coefficients can be created for each resistor by properly selecting and mixing different inks when forming the thick film resistors. Furthermore, attenuators can be created having either a negative temperature coefficient of attenuation or a positive temperature coefficient of attenuation.

Abstract: An absorptive temperature-variable microwave attenuator is produced using at least two temperature-variable (or fixed) resistors in series with a transmission line. The temperature coefficients of the temperature-variable resistors are selected so that the attenuator changes at a controlled rate with changes in temperature while attenuator remains relatively matched to the transmission line. In one embodiment, the resistors are thick-film resistors and a variety of temperature coefficients can be created for each resistor by properly selecting and mixing different inks when forming the resistors. Furthermore, attenuators can be created having either a negative temperature coefficient of attenuation or a positive temperature coefficient of attenuation.

Abstract: A high accuracy programmable attenuator for accurately selecting and maintaining desired values of attenuation for a high frequency RF signal. The attenuator is comprised of a plurality of cells wherein each cell is comprised of an individual attenuator, a switch and a bias resistor. Each bias resistor is comprised of a plurality of individual resistors arranged in a binary sequence and wire bonds are used to short out undesired resistors for compensating for insertion loss and obtaining desired attenuation. The attenuators of the circuit are also arranged in a binary sequence so as to allow the user to select from a large variety of attenuations in small increments.

Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.

Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.