Patents by Inventor Robert J. Bogert

Robert J. Bogert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8289121
    Abstract: Low profile, shielded magnetic components for circuit board applications include self centering core and coil assemblies with coil receptacle and centering projections formed in core pieces that are assembled around a preformed coil. Welding and plating techniques for forming termination structure for the preformed coil avoid thermal shock issues. External gapping elements and agents to form a gapped core structure are avoided, and gap size in the cores may be tightly controlled over large production lot sizes.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: October 16, 2012
    Assignee: Cooper Technologies Company
    Inventors: Yipeng Yan, Robert J. Bogert, Baoqi Wang
  • Publication number: 20080310051
    Abstract: Low profile, shielded magnetic components having self centering core and coil assemblies.
    Type: Application
    Filed: June 13, 2008
    Publication date: December 18, 2008
    Inventors: Yipeng Yan, Robert J. Bogert, Baoqi Wang