Patents by Inventor Robert J. Clarke

Robert J. Clarke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DECODER CIRCUITS FOR THE TRANSMISSION OF VIDEO MEDIA USING SPREAD SPECTRUM DIRECT SEQUENCE MODULATION
    Publication number: 20230327700
    Abstract: The present invention relates generally to video or other media transmission, and more particularly, to encoding and decoding of video media that has been transmitted between a video source and a video sink using spread spectrum direct sequence (SSDS) modulation.
    Type: Application
    Filed: June 12, 2023
    Publication date: October 12, 2023
    Inventors: Robert Steven HANNEBAUER, Robert J. CLARKE
  • Power semiconductor package with conductive clips
    Patent number: 9620471
    Abstract: A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: April 11, 2017
    Assignee: Infineon Technologies Americas Corp.
    Inventors: Martin Standing, Robert J. Clarke
  • Power Semiconductor Package with Conductive Clips
    Publication number: 20150262960
    Abstract: A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.
    Type: Application
    Filed: May 27, 2015
    Publication date: September 17, 2015
    Inventors: Martin Standing, Robert J. Clarke
  • Power semiconductor package
    Patent number: 9048196
    Abstract: A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.
    Type: Grant
    Filed: September 10, 2008
    Date of Patent: June 2, 2015
    Assignee: International Rectifier Corporation
    Inventors: Martin Standing, Robert J. Clarke
  • Conductive chip-scale package
    Patent number: 8097938
    Abstract: A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: January 17, 2012
    Assignee: International Rectifier Corporation
    Inventors: Martin Standing, Robert J Clarke
  • CHIP SCALE PACKAGE
    Publication number: 20090174058
    Abstract: A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
    Type: Application
    Filed: March 17, 2009
    Publication date: July 9, 2009
    Inventors: Martin Standing, Robert J. Clarke
  • Chip-scale package
    Patent number: 7524701
    Abstract: A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
    Type: Grant
    Filed: April 18, 2006
    Date of Patent: April 28, 2009
    Assignee: International Rectifier Corporation
    Inventors: Martin Standing, Robert J Clarke
  • Power semiconductor package
    Publication number: 20090008804
    Abstract: A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.
    Type: Application
    Filed: September 10, 2008
    Publication date: January 8, 2009
    Inventors: Martin Standing, Robert J. Clarke
  • Power semiconductor package
    Patent number: 7466012
    Abstract: A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: December 16, 2008
    Assignee: International Rectifier Corporation
    Inventors: Martin Standing, Robert J Clarke
  • Semiconductor package fabrication
    Patent number: 7402507
    Abstract: A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package or multi-chip module.
    Type: Grant
    Filed: March 3, 2006
    Date of Patent: July 22, 2008
    Assignee: International Rectifier Corporation
    Inventors: Martin Standing, Mark Pavier, Robert J. Clarke, Andrew Sawle, Kenneth McCartney
  • Systems and methods for recording and delivering personalized audio messages
    Patent number: 5444767
    Abstract: Systems and methods for recording and delivering personalized audio messages are provided. The system includes a central facility computer system (CF), a store front programming system (SFS), and a portable playback device (PPD). When a customer desires to send a personalized message to another person, the customer communicates via a telecommunications channel with the CF. Under control of a CF processor, a outgoing message module of the CF provides instructions to the customer, who enters required information and provides the personalized audio message. The personalized audio message is digitized by a CF voice digitizer and transmitted from the CF via a data interface to the SFS. The SFS receives the digitized personalized audio message data from the CF and uses its playback device programmer to program data representing the audio message onto the PPD. The PPD is an audio chip having a nonvolatile memory, an external switch, a battery and a speaker.
    Type: Grant
    Filed: March 9, 1994
    Date of Patent: August 22, 1995
    Assignee: Gregory J. Goetcheus
    Inventors: Gregory J. Goetcheus, Robert J. Clarke, Richard H. Russell