Abstract: Methods, devices and systems are described that enable maintaining the temperature of an optical component at a target temperature despite transient fluctuations in the laser beam that illuminates the component. One example method includes preheating the optical component to a target temperature value by applying an external heat source to the optical component. The optical component has an initial thermal resistance and heat sink temperature while being preheated. Next, the laser is turned on, and the external heat source is removed or reduced, while changing one or both the thermal resistance or heat sink temperature from their initial values to lower values to maintain a temperature of the optical component at the target temperature value while the laser source is illuminating the optical component.

Abstract: The present disclosure relates to a thermoelectric cooling (TEC) embedded electronics system. In one embodiment the system has a substrate having a first surface and a second surface and constructed of a thermally and electrically conductive material, and a die. The die is configured to be supported from the first surface of the substrate and in thermal contact with the substrate. The die forms a heat generating component. A TEC material element is used which has a first surface and a second surface and is configured to be positioned at least partially against the second surface of the substrate. A heat pipe is provided which has a first portion and a second portion. The first portion is configured to be in thermal contact with the second surface of the TEC material, and the second portion is configured to sink heat generated by the die and transmitted through the substrate and the TEC material element.

Abstract: The present technology can be used to control the current injection profile in the longitudinal direction of a high-power diode laser in order to optimize current densities as a function of position in the cavity to promote higher reliable output power and increase the electrical to optical conversion efficiency of the device beyond the level which can be achieved without application of this technique. This approach can be utilized, e.g., in the fabrication of semiconductor laser chips to improve the output power and wall plug efficiency for applications requiring improved performance operation.

Abstract: A pyrolytic graphite (PG) substrate and laser diode package includes a substrate body having a PG crystalline structure with a basal plane oriented at a pre-determined orientation angle as measured from a longitudinal axis of a heat generating material, such as a laser diode, mounted on a surface of the PG substrate, so that a coefficient of thermal expansion (CTE) of the PG substrate is substantially matched with a CTE of the material.

Abstract: The present technology can be used to control the current injection profile in the longitudinal direction of a high-power diode laser in order to optimize current densities as a function of position in the cavity to promote higher reliable output power and increase the electrical to optical conversion efficiency of the device beyond the level which can be achieved without application of this technique. This approach can be utilized, e.g., in the fabrication of semiconductor laser chips to improve the output power and wall plug efficiency for applications requiring improved performance operation.

Abstract: The present technology can be used to control the current injection profile in the longitudinal direction of a high-power diode laser in order to optimize current densities as a function of position in the cavity to promote higher reliable output power and increase the electrical to optical conversion efficiency of the device beyond the level which can be achieved without application of this technique. This approach can be utilized, e.g., in the fabrication of semiconductor laser chips to improve the output power and wall plug efficiency for applications requiring improved performance operation.

Abstract: Thermal management may in some cases improve the optical output of a semiconductor laser diode array. For example, providing gaps such as air gaps, at suitable locations may influence the temperature distribution of laser diodes in a laser diode array and curtail thermal lensing, which may in turn decrease beam divergence and increase delivered power.

Abstract: A Cu—Si—Cu substrate having a silicon substrate, copper plating on opposite sides of the silicon substrate, and copper vias extending thru the silicon substrate to electrically and thermally connect the copper platings together. The thicknesses of the silicon substrate and the copper platings are selected so that a coefficient of thermal expansion (CTE) of the Cu—Si—Cu substrate is substantially the same as a CTE of a material to be mounted on the Cu—Si—Cu substrate.

Abstract: An architecture for an inertial confinement fusion system is disclosed. The system includes a fusion chamber for producing neutrons from a fusion reaction, and a laser system in which lasers are arranged about a vacuum chamber to provide energy to the fusion chamber to initiate the fusion reaction. The beam paths between the lasers and the fusion chamber are configured to prevent neutrons from the fusion chamber from reaching the laser system at a level that would preclude human access to the laser system.

Abstract: A pyrolytic graphite (PG) substrate and laser diode package includes a substrate body having a PG crystalline structure with a basal plane oriented at a pre-determined orientation angle as measured from a longitudinal axis of a heat generating material, such as a laser diode, mounted on a surface of the PG substrate, so that a coefficient of thermal expansion (CTE) of the PG substrate is substantially matched with a CTE of the material.

Abstract: A pyrolytic graphite (PG) substrate and laser diode package includes a substrate body having a PG crystalline structure with a basal plane oriented at a pre-determined orientation angle as measured from a longitudinal axis of a heat generating material, such as a laser diode, mounted on a surface of the PG substrate, so that a coefficient of thermal expansion (CTE) of the PG substrate is substantially matched with a CTE of the material.

Abstract: The present technology can be used to control the current injection profile in the longitudinal direction of a high-power diode laser in order to optimize current densities as a function of position in the cavity to promote higher reliable output power and increase the electrical to optical conversion efficiency of the device beyond the level which can be achieved without application of this technique. This approach can be utilized, e.g., in the fabrication of semiconductor laser chips to improve the output power and wall plug efficiency for applications requiring improved performance operation.

Abstract: A Cu—Si—Cu substrate having a silicon substrate, copper plating on opposite sides of the silicon substrate, and copper vias extending thru the silicon substrate to electrically and thermally connect the copper platings together. The thicknesses of the silicon substrate and the copper platings are selected so that a coefficient of thermal expansion (CTE) of the Cu—Si—Cu substrate is substantially the same as a CTE of a material to be mounted on the Cu—Si—Cu substrate.

Abstract: A laser amplifier module having an enclosure includes an input window, a mirror optically coupled to the input window and disposed in a first plane, and a first amplifier head disposed along an optical amplification path adjacent a first end of the enclosure. The laser amplifier module also includes a second amplifier head disposed along the optical amplification path adjacent a second end of the enclosure and a cavity mirror disposed along the optical amplification path.

Abstract: A pyrolytic graphite (PG) substrate and laser diode package includes a substrate body having a PG crystalline structure with a basal plane oriented at a pre-determined orientation angle as measured from a longitudinal axis of a heat generating material, such as a laser diode, mounted on a surface of the PG substrate, so that a coefficient of thermal expansion (CTE) of the PG substrate is substantially matched with a CTE of the material.

Abstract: An apparatus for use in a friction stir operation, such as friction stir welding (FSW) or friction stir processing (FSP). The apparatus may have a rotating tool adapted to be plunged into a material, where the material is susceptible to being softened by heating. The rotating tool may further be adapted to be advanced along a surface of the material. An optical energy generating subsystem may be used to heat a portion of the material using optical energy as the tool is advanced along the material.

Abstract: A laser amplifier module having an enclosure includes an input window, a mirror optically coupled to the input window and disposed in a first plane, and a first amplifier head disposed along an optical amplification path adjacent a first end of the enclosure. The laser amplifier module also includes a second amplifier head disposed along the optical amplification path adjacent a second end of the enclosure and a cavity mirror disposed along the optical amplification path.

Abstract: A laser amplifier module having an enclosure includes an input window, a mirror optically coupled to the input window and disposed in a first plane, and a first amplifier head disposed along an optical amplification path adjacent a first end of the enclosure. The laser amplifier module also includes a second amplifier head disposed along the optical amplification path adjacent a second end of the enclosure and a cavity mirror disposed along the optical amplification path.

Abstract: Apparatuses, methods, and systems are disclosed to drive pumping laser diode arrays. In implementations, an integrated system can be constructed to in a compact, efficient and cost-effective manner and to meet the needs of driving laser diode arrays in various diode pumped solid state laser applications. The disclosed implementations include individual laser diode drivers or pulsers, methods of communicating with laser diode drivers, and methods of controlling the pulse shape of each laser diode driver.

Abstract: A laser amplifier module having an enclosure includes an input window, a mirror optically coupled to the input window and disposed in a first plane, and a first amplifier head disposed along an optical amplification path adjacent a first end of the enclosure. The laser amplifier module also includes a second amplifier head disposed along the optical amplification path adjacent a second end of the enclosure and a cavity mirror disposed along the optical amplification path.