Patents by Inventor Robert J. Dickenson

Robert J. Dickenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mounting arrangement for semiconductor devices
    Patent number: 5508476
    Abstract: An arrangement for making fatigue-free external connections to a device mounted on a direct copper bonded substrate, in which one or more connector tubes are brazed to respective copper areas on the substrate before the device is mounted on the substrate, and external connections are made by soldering leads or bus bars into the tubes.
    Type: Grant
    Filed: March 24, 1994
    Date of Patent: April 16, 1996
    Assignee: Plessey Semiconductors Limited
    Inventor: Robert J. Dickenson