Patents by Inventor Robert J. Falcone

Robert J. Falcone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Room temperature gold wire wedge bonding process
    Patent number: 6135341
    Abstract: A method of forming a bond structure wherein there are provided a conductive aluminum bond site (15), a gold wire (13) and a wedge bond tool (11). The gold wire is made to contact the aluminum bond site to provide an interface of the gold wire and the aluminum bond site. A mashing force (9) is applied at the interface with the wedge bond tool and ultrasonic energy (5,7) at an ultrasonic frequency above 165 KHz and preferably 193 KHz is applied at the interface for a period sufficient to cause bonding of the gold wire and the aluminum bond site with the application of ultrasonic energy commencing with the interface at room temperature, generally from about 15.degree. C. to about 25.degree. C. The ultrasonic frequency is generally applied for a period from about 0.5 to about 10 milliseconds.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: October 24, 2000
    Assignee: Texas Instruments Incorporated
    Inventor: Robert J. Falcone
  • Method to produce known good die using temporary wire bond, die attach and packaging
    Patent number: 5836071
    Abstract: A method for temporarily packaging a semiconductor die, includes attaching the semiconductor die (40) to a die support (60) in a cavity (58) of package housing (56) with an adhesive (52) that will cures at a first low temperature and volatilizes at a second, higher temperature that is less than the temperature that will drive diffusions in the die deeper and change the electrical characteristics of the die. A reverse bonding process is used to form a first wedge bond with a relatively soft wire (88) on a conductive pad (62) extending into cavity (58) and a second wedge bond on a bond pad (41) on die (40). The wedge tool (76) used to make the wedge bonds has a front radius which is larger than that on conventional wedge tools, so that the cross-sectional area of the bond heel (91) is increased. The increased cross-sectional area and soft wire permit the wire to be removed from the bond pad (41) without breaking the wire or significantly damaging the bond pad.
    Type: Grant
    Filed: December 26, 1996
    Date of Patent: November 17, 1998
    Assignee: Texas Instrument Incorporated
    Inventors: Robert J. Falcone, Stephen R. Martin
  • Ultrasonic bonding process
    Patent number: 5660319
    Abstract: A method for bonding a metal wire (17) to a metal bond site (16) utilizes an ultrasonic power source (12) that is at approximately 162 KHz. A mash force is applied from a pressure source (13) during bonding. A metal exchange takes place between the metal wire (17) and the bond site (16) during the application of the ultrasonic power to produce a strong bond between the metal wire (17) and the bond site (16).
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: August 26, 1997
    Assignee: Texas Instruments Incorporated
    Inventors: Robert J. Falcone, Timothy J. Hogan