Abstract: A method of manufacturing a semiconductor device includes the steps of: taking a semiconductor wafer (8); defining non-conductive region (11) and a conductive region (15) providing electrical contact means (10) at the conductive region; and separating the wafer into a plurality of dies. By using wafer scale fabrication, thousands of devices may be packaged simultaneously in single process steps without significant operator intervention compared to the conventional packaging processes. An insulating wafer (12) may be located over the semiconductor wafer and bonded thereto, the insulating wafer having a plurality of tapered apertures (13) therethrough which are aligned with conducting regions of the semiconductor wafer.