Patents by Inventor Robert J. Gashler

Robert J. Gashler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density connector for stacked circuit boards
    Patent number: 5334029
    Abstract: Disclosed is a device for electrically coupling stocked circuit boards using conductive polymer interconnect material and a spacer element. In one embodiment, coaxial connection is provided by means of an array of wires within undulating metal envelopes. In another embodiment, pins are provided within holes in a plastic spacer. In a third embodiment, wires are laid on a substrate and successive laminations are built up to form the spacer element. In a fourth embodiment, wire arrays are extrusion molded within thermoplastic sheets which are laminated to form the spacer element.
    Type: Grant
    Filed: May 11, 1993
    Date of Patent: August 2, 1994
    Assignee: AT&T Bell Laboratories
    Inventors: Kaushik S. Akkapeddi, Rocco Bonanni, Robert J. Gashler, Michael G. German, William R. Lambert, Eugene C. Schramm
  • High frequency connector
    Patent number: 4806107
    Abstract: Disclosed is a high frequency connector employing a plurality of columns of female contacts for receiving signal carriers and ground/power blades providing shielding between the columns of female contacts. The signal and ground/power blades are coupled to a circuit pack by means of a plurality of flexible circuit sheets. The connector provides full shielding of the signal carriers to the backplane.
    Type: Grant
    Filed: October 16, 1987
    Date of Patent: February 21, 1989
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: Richard M. Arnold, Paul A. Baker, Coleen A. Drucker, Robert J. Gashler, Dominic T. Lipari, Max S. Robin, Howard C. Schell