Abstract: Particulate matter having precisely controlled length, width, thickness (i.e., height) and shape is produced with photolithographic techniques using a release film. In accordance with the method, a first photoresist layer is cured upon a substrate and a second photoresist layer is selectively cured upon the first photoresist to provide a desired pattern. The uncured portions of the second photoresist layer are removed so that a plurality of first and second deposition sites are produced wherein each said first and second deposition site has the desired area and wherein each first deposition site is located in a first plane and each second deposition site is located in a second plane. Further, portions of the substrate which are not part of the first deposition site are not located in the first plane and portions of the substrate which are not part of a second deposition site are not located in the second plane. The desired material is deposited using line-of-sight chemical deposition techniques.