Abstract: An injection molded aluminum nitride heatsink forms the substrate of an integral heatsink semiconductor package in which a semiconductor chip is attached directly to the integrated heatsink forming an intimate thermal relationship between the heat generating source and the heat dissipating means. In a first embodiment, a planar surface of the heatsink component provides the substrate for the attachment of a semiconductor chip and a multilayer housing formed from a plurality of layers of dielectric glass ceramic lamina and conductive circuit layers. The multilayer housing is formed on top of the heatsink substrate creating a recessed cavity in which the semiconductor die sits and is attached directly to the heatsink. The semiconductor chip is attached to the circuit layers of the housing through any of the known electrical connection methods, such as wirebonding or tab tape. A cover plate is mounted over the cavity.

Abstract: A semiconductor package for protecting a semiconductor chip such as a Very Large Scale Integration chip and connecting it to an electrical circuit is disclosed. The chip is bonded to a section of Tape Automated Bonding, (TAB), tape which contains a number of leads thereover, each lead has an inner lead section bonded to the chip and an outer lead section that extends beyond the outer perimeter of the tape, for connecting to the circuit. The chip is enclosed in a housing which subtends an area slightly larger than the chip itself. The inner lead sections project from the TAB tape into the housing and are bonded to the chip. A metal layer under the TAB tape is connected to a number of the leads. After the semiconductor package of this invention is assembled, the outer leads are attached to the associated circuit so as to connect the chip to the circuit. The metal layer serves as a reference plane so the leads connected thereto supply a voltage that does not very to sub-circuits on the chip.

Abstract: An integral heat pipe for transferring heat away from electronic components is disclosed. The heat pipe comprises at least one electronic component mounted to a substrate. A condenser cap is fastened over the substrate to define a sealed pipe chamber around the electronic component. The top of the condenser cap facing the component is a condenser surface and is provided with a number of parallel fluted sections. Each fluted section has parallel vertical sidewalls and a semi-circular top section. A multi-layered fiberous, porous, wick is located between the condenser surface flutes and the top of the electrical component. The top of the component may be provided with a number of parallel grooves exposed to the wick. The pipe chamber is filled with a two-phase working fluid. The heat generated by the electrical component causes the liquid fraction of the working fluid adjacent the component to evaporate. The vapor travels to the fluted condensing surface.