Abstract: Manual mounting of large high density lead insertion connectors (1) onto circuit boards (3) is achieved by simultaneously engaging all connector leads (2) with a comb (9), sliding the engaged leads into alignment with receiving passageways (4) in the circuit board and pressing the connector leads into the receiving passageways. The comb has an exterior surface forming channels (10) corresponding in spatial relationship to the lead receiving passageways. A connector lead insertion apparatus (5, 6, 7, 8, 9, 10) is utilized in conjunction with the lead insertion method to hold the circuit board and connector in fixed position with respect to each other. The apparatus further permits the comb to be guided into proper position prior to engaging the connector leads.