Abstract: A processing system directs a laser beam to a composite including a substrate, a conductive layer, and a conductive border. The location of a focus of the laser beam can be controlled to bring the laser beam into focus on the surfaces of the conductive materials. The laser beam can be used to ablatively process the conductive border and non-ablatively process the conductive layer by translating a focus-adjust optical system so as to vary laser beam diameter.

Abstract: A method of non-ablatively laser patterning a multi-layer structure, the multi-layer structure including a substrate, a first layer disposed on the substrate, a second layer disposed on the first layer, and a third layer disposed on the second layer, the method including generating at least one laser pulse having laser parameters selected for non-ablatively changing the conductivity a selected portion of the third layer such that the selected portion becomes non-conductive, and directing the pulse to the multi-layer structure, wherein the conductivity of the first layer is not substantially changed by the pulse.

Abstract: A laser lift-off method includes generating a plurality of solid state laser pulses, converting the plurality of solid state laser pulses to an ultraviolet frequency, adjusting the transverse spatial intensity profile of the plurality of laser pulses across perpendicular transverse axes to be rectangular in shape with the shape along each transverse axis corresponds to a super-Gaussian of order eight or higher, and scanning the plurality of laser pulses across the target along a direction parallel to one of the transverse axes in order to produce laser lift-off on the target. Systems for laser lift-off are also disclosed.

Abstract: Processes such as annealing amorphous silicon to form polysilicon use exposures to pulsed laser beams provided by laser diodes or arrays of laser diodes. An optical beam based on plurality of beams from respective laser diodes is shaped and directed to a substrate. Duty cycles of the laser diodes are selected to be less than about 0.2, so that °s can be greater than available in continuous wave operation. An amorphous silicon layer on a rigid or flexible substrate is processed to produce a polysilicon layer with a mobility of at least 50 cm2/Vs.

Abstract: Multi-beam, multi-wavelength processing systems include two or more lasers configured to provide respective beams to a substrate. The beams have wavelengths, pulse durations, beam areas, beam intensities, pulse energies, polarizations, repetition rates, and other beam properties that are independently selectable. Substrate distortion in processes requiring local heating can be reduced by preheating with a large area beam at a first wavelength followed by exposure to a focused beam at a second wavelength so as to heat a local area to a desired process temperature. For some processing, multiple wavelengths are selected to obtain a desired energy deposition within a substrate.

Abstract: A method for processing a transparent substrate includes generating at least one laser pulse having laser parameters selected for non-ablatively changing a conductive layer disposed on the transparent substrate into a non-conductive feature, and directing the pulse to said conductive layer. A protective film may be affixed to a surface of the transparent substrate and need not be removed during the processing of the substrate. After processing, processed areas can be visually indistinguishable from unprocessed areas.

Abstract: Laser pulses from pulsed fiber lasers are directed to an amorphous silicon layer to produce a polysilicon layer comprising a disordered arrangement of crystalline regions by repeated melting and recrystallization. Laser pulse durations of about 0.5 to 5 ns at wavelength range between about 500 nm and 1000 nm, at repetition rates of 10 kHz to 10 MHz can be used. Line beam intensity uniformity can be improved by spectrally broadening the laser pulses by Raman scattering in a multimode fiber or by applying varying phase delays to different portions of a beam formed with the laser pulses to reduce beam coherence.

Abstract: A laser system capable of producing a stable and accurate high-power output beam from one or more input beams of corresponding laser sources comprises one or more optical elements configured to receive the input beams wherein at least one of said one or more optical elements is made of high purity fused silica.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: A laser imaging system with reduced speckle is disclosed. The laser imaging system includes spatially superpositioned 1-D arrays or alternatively 2-D arrays of independent emitters of laser radiation, with each emitter having a spectral bandwidth ??i centered at some arbitrary wavelength ?0i. The elements of the array are allowed, by design, to have a slightly different central wavelength, thereby creating an ensemble bandwidth ?? which is much greater than the bandwidth ??i of any individual emitter in the array. The resulting increased bandwidth reduces speckle in a displayed image.

Abstract: A laser imaging system with reduced speckle is disclosed. The laser imagning system includes spatially superpositioned 1-D arrays or alternatively 2-D arrays of independent emitters of laser radiation, with each emitter having a spectral bandwidth &Dgr;&lgr;i centered at some arbitrary wavelength &lgr;0i. The elements of the array are allowed, by design, to have a slightly different central wavelength, thereby creating an ensemble bandwidth &Dgr;&Lgr; which is much greater than the bandwidth &Dgr;&lgr;i of any individual emitter in the array. The resulting increased bandwidth reduces speckle in a displayed image.

Abstract: A full color, pulsed laser video system having solid state red (R), green (G) and blue (B) lasers (10, 12, 14) as a source, and with a projection screen having a two-channel image (24) for the screen, and with optical fiber remote image delivery (30).