Abstract: A system comprising a spinning disk is disclosed. The system comprises a semiconductor processing system, such as a high energy implantation system. The semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces, which are disposed on the spinning disk. The spinning disk comprises a rotating central hub with a plurality of platens. The spinning disk rotates about a central axis. The spinning disk is also translated linearly in a directional perpendicular to the central axis. The spot ion beam strikes the spinning disk at a distance from the central axis, referred to as the radius of impact. The rotation rate and the scan velocity may both vary inversely with the radius of impact.

Abstract: Disclosed is a rotary union including an inner shaft, wherein the inner shaft is rotatable and includes an internal channel operable to deliver a cryogenic fluid to a platen. The rotary union may further include a rotary union shaft surrounding the inner shaft, and a seal assembly coupled to the rotary union shaft. The seal assembly may include a support, a metal bellows extending around an exterior of the support, and a seal support coupled to the metal bellows, wherein the seal support extends around the support. The seal assembly may further include a non-rotating seal component seated in the seal support, and a rotating seal component in abutment with the non-rotating seal component to create a mechanical seal therebetween.

Abstract: A cryogenic heat transfer system including a platen supported by a rotatable shaft, a housing surrounding a portion of the rotatable shaft, the housing including an annular heat sink surrounding the rotatable shaft and defining a heat transfer gap between the heat sink and the rotatable shaft, the heat sink including a fluid conduit extending therethrough for circulating a first cooling fluid through the heat sink, a first dynamic seal arrangement extending from a first axial end of the heat sink and surrounding the rotatable shaft, and a second dynamic seal arrangement extending from a second axial end of the heat sink opposite the first axial end and radially surrounding the rotatable shaft, wherein the heat sink and the first and second dynamic seal arrangements define a fluidically sealed volume surrounding the rotatable shaft, the fluidically sealed volume containing a second cooling fluid.

Abstract: An ion implantation apparatus, system, and method are provided for transferring a plurality of workpieces between vacuum and atmospheric pressures, wherein an alignment mechanism is operable to align a plurality of workpieces for generally simultaneous transportation to a dual-workpiece load lock chamber. The alignment mechanism comprises a characterization device, an elevator, and two vertically-aligned workpiece supports for supporting two workpieces. First and second atmospheric robots are configured to generally simultaneously transfer two workpieces at a time between load lock modules, the alignment mechanism, and a FOUP. Third and fourth vacuum robots are configured to transfer one workpiece at a time between the load lock modules and a process module.

Abstract: Disclosed is a rotary union including an inner shaft, wherein the inner shaft is rotatable and includes an internal channel operable to deliver a cryogenic fluid to a platen. The rotary union may further include a rotary union shaft surrounding the inner shaft, and a seal assembly coupled to the rotary union shaft. The seal assembly may include a support, a metal bellows extending around an exterior of the support, and a seal support coupled to the metal bellows, wherein the seal support extends around the support. The seal assembly may further include a non-rotating seal component seated in the seal support, and a rotating seal component in abutment with the non-rotating seal component to create a mechanical seal therebetween.

Abstract: Systems and methods for facilitating expeditious handling and processing of semiconductor substrates with a minimal number of handling devices. Such a system may include an entry load-lock configured to transfer substrates from an atmospheric environment to a vacuum chamber, an alignment station disposed in the vacuum chamber and configured to adjust orientations of substrates, a first vacuum robot configured to move substrates from the entry load-lock to the alignment station, a process station disposed in the vacuum chamber and configured to perform a designated process on substrates, first and second exit load-locks configured to transfer substrates from the vacuum chamber to the atmospheric environment, and a second vacuum robot configured to move substrates from the alignment station to the process station and further configured to move substrates from the process station to the first exit load-lock and to the second exit load-lock in an alternating fashion.

Abstract: Embodiments of the disclosure provide proportional integral derivative control (PID) using multiple actuators. In one embodiment, a process includes providing a PID controller in communication with a primary actuator and a secondary actuator, the primary actuator and the secondary actuator coupled to a handler. The process further includes receiving position feedback and a specified trajectory for the handler, and generating a dynamic feedforward force command and a position correction command for the handler based on the position feedback and the specified trajectory. The process further includes providing, from the PID controller, the dynamic feedforward force command to the secondary actuator and the position correction command to the primary actuator.

Abstract: Embodiments of the disclosure provide proportional integral derivative control (PID) using multiple actuators. In one embodiment, a process includes providing a PID controller in communication with a primary actuator and a secondary actuator, the primary actuator and the secondary actuator coupled to a handler, such as a robotic arm for manipulating an object. The process further includes receiving position feedback and a specified trajectory for the handler, and generating a dynamic feedforward force command and a position correction command for the handler based on the position feedback and the specified trajectory. The process further includes providing, from the PID controller, the dynamic feedforward force command to the secondary actuator and the position correction command to the primary actuator.

Abstract: Embodiments of the disclosure provide proportional integral derivative control (PID) using multiple actuators. In one embodiment, a process includes providing a PID controller in communication with a primary actuator and a secondary actuator, the primary actuator and the secondary actuator coupled to a handler, such as a robotic arm for manipulating an object. The process further includes receiving position feedback and a specified trajectory for the handler, and generating a dynamic feedforward force command and a position correction command for the handler based on the position feedback and the specified trajectory. The process further includes providing, from the PID controller, the dynamic feedforward force command to the secondary actuator and the position correction command to the primary actuator.

Abstract: Embodiments of the disclosure provide proportional integral derivative control (PID) using multiple actuators. In one embodiment, a process includes providing a PID controller in communication with a primary actuator and a secondary actuator, the primary actuator and the secondary actuator coupled to a handler. The process further includes receiving position feedback and a specified trajectory for the handler, and generating a dynamic feedforward force command and a position correction command for the handler based on the position feedback and the specified trajectory. The process further includes providing, from the PID controller, the dynamic feedforward force command to the secondary actuator and the position correction command to the primary actuator.

Abstract: An ion implantation apparatus, system, and method are provided for transferring a plurality of workpieces between vacuum and atmospheric pressures, wherein an alignment mechanism is operable to align a plurality of workpieces for generally simultaneous transportation to a dual-workpiece load lock chamber. The alignment mechanism comprises a characterization device, an elevator, and two vertically-aligned workpiece supports for supporting two workpieces. First and second atmospheric robots are configured to generally simultaneously transfer two workpieces at a time between load lock modules, the alignment mechanism, and a FOUP. Third and fourth vacuum robots are configured to transfer one workpiece at a time between the load lock modules and a process module.

Abstract: An ion implantation apparatus including an enclosure defining a process chamber, a carriage slidably mounted on a shaft within the process chamber and coupled to a drive mechanism adapted to selectively move the carriage along the shaft. A platen assembly can be coupled to the carriage, and a linkage conduit can extend between a side wall of the enclosure and the carriage. The linkage conduit can include a plurality of pivotably interconnected linkage members that define a contiguous internal volume that is sealed from the process chamber. The contiguous volume can be held at a desired vacuum pressure separate from the vacuum environment of the process chamber.

Abstract: A substrate scanning device includes first, second and third linkages, and a direct drive motor coupled between a process chamber and a first end of the first linkage. A first gear motor coupled between a second end of the first linkage and a first end of the second linkage and a second gear motor coupled between a second end of the second linkage and a first end of the third linkage. A substrate support surface coupled to a second end of the third linkage. The direct drive motor for moving the substrate support surface parallel to a scan axis as the direct drive motor moves the substrate support surface along the scan axis. The first and second gear motors can be configured to maintain the substrate support surface in a plane approximately parallel with the scan axis.

Abstract: An ion implantation apparatus including an enclosure defining a process chamber, a carriage slidably mounted on a shaft within the process chamber and coupled to a drive mechanism adapted to selectively move the carriage along the shaft. A platen assembly can be coupled to the carriage, and a linkage conduit can extend between a side wall of the enclosure and the carriage. The linkage conduit can include a plurality of pivotably interconnected linkage members that define a contiguous internal volume that is sealed from the process chamber. The contiguous volume can be held at a desired vacuum pressure separate from the vacuum environment of the process chamber.

Abstract: Systems and methods for facilitating expeditious handling and processing of semiconductor substrates with a minimal number of handling devices. Such a system may include an entry load-lock configured to transfer substrates from an atmospheric environment to a vacuum chamber, an alignment station disposed in the vacuum chamber and configured to adjust orientations of substrates, a first vacuum robot configured to move substrates from the entry load-lock to the alignment station, a process station disposed in the vacuum chamber and configured to perform a designated process on substrates, first and second exit load-locks configured to transfer substrates from the vacuum chamber to the atmospheric environment, and a second vacuum robot configured to move substrates from the alignment station to the process station and further configured to move substrates from the process station to the first exit load-lock and to the second exit load-lock in an alternating fashion.

Abstract: An apparatus that uses a combination of mechanical contact bearings and air bearings is disclosed. The apparatus includes a fixed seal housing, attached to a process chamber and a floating seal cartridge, which is disposed in proximity to the fixed seal housing. A shaft is disposed with an aperture in the process chamber, the central opening in the fixed seal housing and the second central opening in the floating seal cartridge. A first air bearing is created between the shaft and the floating seal cartridge in the second central opening. A second air bearing is created between the floating seal cartridge and the fixed seal housing. In this way, the floating seal cartridge is free to move with the shaft radially, while still maintaining a seal between the process chamber and the external environment.

Abstract: Various embodiments of a device, system and methods that promote safety and security within an organization. Sensor data from one or more installation sensors is collected, analyzed and used to create a map and/or directions that, when received by a wireless mobile device, facilitate a person's possible egress around or from a detected event. The information provided to the person by the map and/or the directions may be individually crafted to be of maximum use to the specific recipient so the person can understand, plan and execute the most appropriate danger avoidance maneuvers in minimal time.

Abstract: A method is provided of determining the internal cross-sectional area of a pipe along its length. The method includes the steps of: (a) filling the pipe with a first fluid; (b) feeding a second fluid into the pipe at a known flow rate, a meniscus being formed between the first and the second fluid, and the meniscus moving along the pipe as the second fluid displaces the first fluid in the pipe; (c) ultrasonically detecting the position of the meniscus as it moves along the pipe; and (d) determining from the second fluid flow rate and the meniscus position, the internal cross-sectional area of the pipe along its length.

Abstract: A method for inspecting the interior of a non-horizontal pipe includes (a) filling the pipe with a first fluid, (b) feeding a second fluid into a lower part of the pipe when the second fluid is more dense than the first fluid or into an upper part of the pipe when the second fluid is less dense than the second fluid the pipe, a meniscus forming between the first and the second fluid and moving along the pipe, (c) introducing an inspection device having an average density between the densities of the first and second fluids such that the device locates at and moves with the meniscus, (d) obtaining inspection data from the inspection device as the device moves along the pipe, (e) determining positions of the meniscus as it moves along the pipe, and (f) relating the meniscus positions to positions at which the inspection data is obtained.

Abstract: A ternary nickel eutectic alloy consisting of 4.5 to 11 wt % chromium, 1 to 6 wt % cobalt, 1 to 4 wt % aluminum, 0 to 1.5 wt % titanium, 0 to 3 wt % tantalum, 16 to 22 wt % niobium, 0 to 3 wt % molybdenum, 0 to 4 wt % tungsten, 0 to 1 wt % hafnium, 0 to 0.1 wt % zirconium, 0 to 0.1 wt % silicon, 0.01 to 0.1 wt % carbon, 0 to 0.01 wt % boron and the balance nickel plus incidental impurities.