Abstract: A tubular stress control article having an axial bore with a length comprises a first and innermost layer formed from an electrical stress control composition having a filler material comprising nanosilica-modified inorganic particles and a discontinuous arrangement of conductive material dispersed in an elastomeric material. At least a portion of the conductive material is in durable electrical contact with the inorganic particles. The article further comprises a second layer disposed on the first layer, the second layer comprising an electrical insulation material. The article also comprises a third layer disposed on the second layer, the third layer comprising an elastomeric stress control material. The article further comprises a fourth layer disposed on the third layer, the fourth layer comprising a track-resistant elastomeric material. Each of the first, second, third, and fourth layers are substantially continuous along the length of the axial bore.

Abstract: A tubular stress control article having an axial bore with a length comprises a first and innermost layer formed from an electrical stress control composition having a filler material comprising nanosilica-modified inorganic particles and a discontinuous arrangement of conductive material dispersed in an elastomeric material. At least a portion of the conductive material is in durable electrical contact with the inorganic particles. The article further comprises a second layer disposed on the first layer, the second layer comprising an electrical insulation material. The article also comprises a third layer disposed on the second layer, the third layer comprising an elastomeric stress control material. The article further comprises a fourth layer disposed on the third layer, the fourth layer comprising a track-resistant elastomeric material. Each of the first, second, third, and fourth layers are substantially continuous along the length of the axial bore.

Abstract: A cold-shrink article having a chamber with an enlarged interior section to prevent the collapse of an end of a support core placed in the chamber.

Abstract: A process for forming gate structures is described. A web comprises a substrate, a plurality of conductive elements disposed on the substrate, and a conductive anodization bus. The web is moved through an anodization station to form a plurality of gate structures comprising a plurality of gate dielectrics adjacent to a plurality of gate electrodes. A process for forming electronic devices further providing a semiconductor, a source electrode, and a drain electrode is described.

Abstract: A cold-shrink article having a chamber with an enlarged interior section to prevent the collapse of an end of a support core placed in the chamber.

Abstract: A process for forming gate structures is described. A web comprises a substrate, a plurality of conductive elements disposed on the substrate, and a conductive anodization bus. The web is moved through an anodization station to form a plurality of gate structures comprising a plurality of gate dielectrics adjacent to a plurality of gate electrodes. A process for forming electronic devices further providing a semiconductor, a source electrode, and a drain electrode is described.

Abstract: A test system is provided for simulating pre-tensioner systems that use pyrotechnic gas generators. In a preferred form, the test system includes a pneumatic cylinder energized by pressurized air from an accumulator and passing through a fast acting ball valve. A substantially linear relationship is established between accumulator pressure and the time rate of change of acceleration of a piston in the pneumatic cylinder. Use of the test system allows improved evaluation of seat belt systems employing pre-tensioners with pyrotechnic gas generators.

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract: A printed circuit including a dielectric substrate and a conductive trace attached to a surface of the dielectric substrate. The trace includes a base layer and a coverplate layer on a portion of the base layer. The coverplate layer defines a coverplate edge on the base layer. A protective layer is formed on a portion of the coverplate layer. The protective layer extends beyond the coverplate edge onto at least a portion of the base layer of the trace. A key aspect of the present invention is that the protective layer overlaps the coverplate edge of each trace to reduce the potential for corrosion of the base layer at the coverplate edge.

Abstract: A mounting mechanism is provided for mounting an air bag module to a support plate of a vehicle. The mounting mechanism includes a single, generally flat blank of material formed to provide a generally flat base plate and a plurality of generally flat elongated mounting members which are each bent to extend downwardly from the base plate. The mounting members are adapted for attachment to the vehicle whereby the module is attached to the vehicle. Preferably, the mounting members are bent to extend generally at 90 degrees from the base plate. Advantageously, the mounting mechanism is easily made by providing a single flat blank of material and stamping the blank to form the planar outline of a base plate and elongated mounting members which are integrally formed as a single flat piece with the base plate and then by bending each of the mounting members at approximately 90 degrees relative to the base plate such that the mounting members extend downwardly from the base plate.