Patents by Inventor Robert J. Testa

Robert J. Testa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of providing a printed circuit board with an edge connection portion
    Patent number: 7712210
    Abstract: A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.
    Type: Grant
    Filed: June 7, 2007
    Date of Patent: May 11, 2010
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Thomas R. Miller, Duane A. Stanke, Robert J. Testa
  • Method of providing a printed circuit board with an edge connection portion
    Publication number: 20080301933
    Abstract: A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.
    Type: Application
    Filed: June 7, 2007
    Publication date: December 11, 2008
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Thomas R. Miller, Duane A. Stanke, Robert J. Testa
  • Method for producing an electronic package possessing controlled impedance characteristics
    Patent number: 6845557
    Abstract: A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, disclosed is the provision of a method for producing an impedance controlled printed circuit wiring board. Also, there is the provision of a method for producing high speed printed wiring boards with multiple differential impedance controlled layers.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: January 25, 2005
    Assignee: International Business Machines Corporation
    Inventors: Thomas R. Miller, William J. Rudik, Robert J. Testa, Kevin P. Unger, Michael Wozniak
  • Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
    Publication number: 20020189094
    Abstract: A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, disclosed is the provision of a method for producing an impedance controlled printed circuit wiring board. Also, there is the provision of a method for producing high speed printed wiring boards with multiple differential impedance controlled layers.
    Type: Application
    Filed: August 22, 2002
    Publication date: December 19, 2002
    Applicant: International Business Machines Corporation
    Inventors: Thomas R. Miller, William J. Rudik, Robert J. Testa, Kevin P. Unger, Michael Wozniak
  • Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
    Patent number: 6469256
    Abstract: A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, disclosed is the provision of a method for producing an impedance controlled printed circuit wiring board. Also, there is the provision of a method for producing high speed printed wiring boards with multiple differential impedance controlled layers.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: October 22, 2002
    Assignee: International Business Machines Corporation
    Inventors: Thomas R. Miller, William J. Rudik, Robert J. Testa, Kevin P. Unger, Michael Wozniak