Abstract: Systems and methods for etching topographic features in non-crystalline or metallic substrates are provided. A protective material is placed and patterned on a surface of the substrate to define exposed and protected regions of the substrate for etching in a liquid etchant having etching rates that are thermally activated. A nonuniform temperature profile is imposed on the substrate so that the temperatures and hence the etching rates at surfaces in the exposed regions are higher than those in the protected regions. Arrangements for imposing the nonuniform temperature profile include heating designated portions of the substrate with light radiation. Alternatively, the non-uniform temperature profile is developed as etching progresses by passing current pulses through the substrate in a manner that causes geometrically non-uniform heating of the substrate.

Abstract: A method and apparatus for fabricating or altering a microstructure use means for heating to facilitate a local chemical reaction that forms or alters the submicrostructure.

Abstract: Systems and methods for plating and/or etching of hard-to-plate metals are provided. The systems and methods are designed to overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates. The systems and methods involve in situ removal of coating materials from the surfaces of the metal substrates while the substrates are either submerged in plating or etching solutions, or are positioned in a proximate enclosure just prior to submersion in the plating or etching solutions. Further, the substrates can be in contact with a suitable patterning mask to obtain patterned oxide-free regions for plating or etching. This in situ removal of coating layers may be achieved by pulse heating or photoablation of the substrate and the inhibiting coating layers. Electrical energy or laser light energy may be used for this purpose. Additionally or alternatively, the coating materials may be removed by mechanical means.

Abstract: Provides protection to wireless portable transponders from an unauthorized interrogation by employing a mechanical member. Transponders include: cards, fobs and RFID tags that a persons may carry. Such transponders generally have means for receiving and storing electronic and other information, commonly in binary form using memories as in electronic circuits, etc. The invention is designed to provide privacy of electronic information and yet permit the information to be queried at the users discretion. The cards and tags can be protected from receiving or providing unauthorized or unwanted information. The invention provides the mechanical member with means that permit the owner to decide when reception/interrogation of personal or other information is desirable by employing the provided mechanical enable/disable control means.

Abstract: A method and apparatus for fabricating or altering a microstructure use means for heating to facilitate a local chemical reaction that forms or alters the submicrostructure.

Abstract: The invention provides protection to wireless portable transponders from unauthorized interrogation by employing a mechanism for disabling reception by or from the antenna of the transponder. Transponders include RFID tags that are attached to items that a persons may purchase or carry. Such transponders generally have an ability for receiving and storing electronic and other information, commonly in binary form using memories as in electronic circuits, etc. The invention is designed to provide privacy of electronic information. The tags can be protected from receiving or providing unauthorized or unwanted information. The invention provides the mechanism that permit the owner to decide when reception/interrogation of personal or other information is not desired by employing the provided mechanical disable control.

Abstract: A method of joining two panels during the manufacturing of a LCD display employing the ODF (One Drop Fill) assembly technique. Using this method, the liquid crystal is deposited on one of the substrate's interior to the glue seal. The glue seal is pre-deposited near the peripheral edge of the substrates. The two substrates are then brought in contact with one another. The glue seal must be cured rapidly in order to seal the entire periphery while avoiding contamination between the glue seal, in the liquid state and the liquid crystal. The present invention teaches the use of a non-epoxy glue sealant, which is cured using photoinitiators. Experimental research has discovered the use of photons that are derived from laser beams and the control thereof. This allows for a faster, lower temperature cure.

Abstract: In one embodiment, the invention is a method and apparatus for recycling exhaust air expelled from a computer server (e.g., a unit including microprocessors such as a standard server or a mainframe). In one embodiment, at least one windmill (e.g., a standard windmill or a wind turbine) is driven by the exhaust air from at least one server unit, and the at least one windmill in turn drives a generator. Therefore, energy previously wasted in the form of exhaust is harnessed and reused to provide power to the server system. The method and apparatus also reduce the demand placed on ventilation systems needed to cool server environments, further reducing the amount of energy consumed and/or wasted in the operation of a server system. In one embodiment, the electric power from the generator unit is either recycled into the power grid. In another embodiment, the recycled air is used to charge batteries that might be available as power standby units.

Abstract: A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.

Abstract: One embodiment of the present method and apparatus for detecting leaks in a fluid cooling system enables a user to rapidly detect fluid leaks in the vicinity of a microprocessor chip or other delicate item. In one embodiment, the invention comprises a detector and a border coupled to the detector and disposed peripherally about a protected item (e.g., the microprocessor chip or other delicate item). In one embodiment, the border is a layered structure that is adapted to complete an electrical circuit with the detector when the border comes into contact with fluid.

Abstract: A method of joining two panels during the manufacturing of a LCD display employing the ODF (One Drop Fill) assembly technique. Using this method, the liquid crystal is deposited on one of the substrate's interior to the glue seal. The glue seal is pre-deposited near the peripheral edge of the substrates. The two substrates are then brought in contact with one another. The glue seal must be cured rapidly in order to seal the entire periphery while avoiding contamination between the glue seal, in the liquid state and the liquid crystal. The present invention teaches the use of a non-epoxy glue sealant, which is cured using photoinitiators. Experimental research has discovered the use of photons that are derived from laser beams and the control thereof. This allows for a faster, lower temperature cure.

Abstract: A structure (microduct) for temperature management (e.g., cooling) of the surface temperature of an electronic device (e.g., a microprocessor). In an embodiment of the present invention, the system includes an upper plate , wherein the upper plate has a bottom surface forming the top portion and sides of the microduct structure, and wherein the top surface of a lower wall forms the bottom surface of the microduct structure. The lower wall can be adapted to be coupled to a top surface of device. The microduct structure further includes a coolant that flows through the microduct to provide cooling for a device.

Abstract: A system and method for measuring thermal distributions of an electronic device during operation is disclosed. The system includes an electronic device, a heat sink adjacent to the electronic device and an electrical-insulating layer disposed on the electronic device so as to separate the electronic device and the heat sink. The system further includes a plurality of thermal sensors located on the electrical-insulating layer, each of the plurality of thermal sensors in a different location. The plurality of thermal sensors is located within one or more thin film circuit layers disposed adjacent to the electrical insulating layer. The system further includes a module for receiving thermal information from the plurality of thermal sensors during operation of the electronic device. The system further includes a processor coupled to the module for generating a thermal distribution of the electronic device based on the thermal information received from the plurality of thermal sensors.

Abstract: A method of cleaning using an insonified, pressurized liquid to cleanse and then wash off particulates. The liquid is used to focus and direct the acoustical energy while enabling the trapping of the partials being cleaned and then used to wash off the partials. The acoustical frequency and power is described as optimized to be below the energy level to cause cavitation at the surface of the part being cleaned. The manufacturing process of loading, cleaning and unloading is also described. In another embodiment, a small amount of cavitation is acceptable if the cavitation is below a threshold in which shock waves occur.

Abstract: The present invention provides a substrate having thereon a patterned small molecule organic semiconductor layer. The present invention also provides a method and a system for producing a substrate having thereon a patterned small molecule organic semiconductor layer. The substrate having thereon a patterned small molecule organic semiconductor layer is produced by exposing a donor substrate having thereon a small molecule organic semiconductor layer to energy to cause the thermal transfer of a small organic molecule onto an acceptor substrate.

Abstract: The present invention provides a substrate having thereon a patterned small molecule organic semiconductor layer. The present invention also provides a method and a system for the production of the substrate having thereon a patterned small molecule organic semiconductor layer. The substrate with the patterned small molecule organic semiconductor layer is prepared by exposing a region of a substrate having thereon a film of a precursor of a small organic molecule to energy from an energy source to convert the film of a precursor of a small organic molecule to a patterned small molecule organic semiconductor layer.

Abstract: A system and method for maintaining a dispensing system a desired distance between a dispenser and a surface is shown. The system includes a light-emitting device, connected to the dispenser, that emits light in the direction of the surface. The emitted light is reflected off of the surface as well as a mirror connected to the dispenser. Subsequently, all reflected light is received by a sensor. Using the sensor data, a computer calculates the distance between the dispenser and the surface. A servo device then adjusts the location of the dispenser, in accordance with the calculated distance, in order to maintain the desired distance between the dispenser and the surface. One advantage of the system and method is the increased ability to maintain a desired distance between the dispenser and the surface. This can lead to increased and higher quality production by a dispensing system.

Abstract: A self-alignment process for the precise alignment in a deposited diamond-like carbon (DLC), which results in a wider viewing angle for the display being manufactured. The process involves ion bombardment, which is swept across the liquid crystal panel in a two-pass process. In one embodiment, both ion sweeps are aligned at a 45-degree angle with respect to the bottom edge of the panel. The first pass is accomplished without any electrical bias on the panel. During the first pass the impinging ions may be at an angle with respect to a point on a plane defined by the surface of the panel that is less than 90 degrees. The second ion sweep is accomplished with the impinging ions at a second angle, greater than 90 degrees up to 180 degrees with respect to the point on the plane defined by the surface.

Abstract: A system and method for maintaining a dispensing system a desired distance between a dispenser and a surface is shown. The system includes a light-emitting device, connected to the dispenser, that emits light in the direction of the surface. The emitted light is reflected off of the surface as well as a mirror connected to the dispenser. Subsequently, all reflected light is received by a sensor. Using the sensor data, a computer calculates the distance between the dispenser and the surface. A servo device then adjusts the location of the dispenser, in accordance with the calculated distance, in order to maintain the desired distance between the dispenser and the surface. One advantage of the system and method is the increased ability to maintain a desired distance between the dispenser and the surface. This can lead to increased and higher quality production by a dispensing system.

Abstract: A method of cleaning using an insonified, pressurized liquid to cleanse and then wash off particulates. The liquid is used to focus and direct the acoustical energy while enabling the trapping of the partials being cleaned and then used to wash off the partials. The acoustical frequency and power is described as optimized to be below the energy level to cause cavitation at the surface of the part being cleaned. The manufacturing process of loading, cleaning and unloading is also described. In another embodiment, a small amount of cavitation is acceptable if the cavitation is below a threshold in which shock waves occur.