Abstract: Novel directly solderable three-dimensional electrically conductive circuit components are made by forming firmly adherent metal coatings on smooth thermoplastic substrates, e.g., polyether imides, by sputtering the metal directly onto the substrate, without any surface preparation or treatment of the substrate, under sputtering conditions which cause at least a portion of the sputtered metal, e.g., copper, to be imbedded into and below the substrate surface. Another metal coating can be provided by sputtering, or electro or electroless deposition over the sputter-deposited coating.

Abstract: A container which may be used as a sandbox, swimming pool, or play area simulates an animal configuration. The lower portion of the container, supported on simulated animal legs, is surrounded by an oval shaped rim for sitting on. A cover in the form of a simulated animal's back is guided for vertical movement by vertical supports and raised or lowered by a crankbar connected thereto by a plurality of lines to give access to the interior of the container. Simulated animal appendages such as heads, tails, etc. can extend from the container. One version is a simulated turtle.