Abstract: A flexible pipe loop for absorbing or compensating for movement in a pipe run, and for reducing stresses in the pipe run. The loop comprises a pair of pipe run elbows, a pair of flexible tube members, a pair of loop elbows, and a third flexible tube member. The pipe run elbows are oppositely disposed, and each has a first open end to be connected to the pipe run, and a second open end. The pair of flexible tube members each have first and second open ends. The first open ends of the tube members are connected to the second open ends of the pipe run elbows, respectively. The loop elbows are disposed in a spaced-apart opposing relation, and each has first and second open ends. The first open ends of the loop elbows are connected to the second open ends of the pair of tube members, respectively. Finally, the third flexible tube member is connected between, and to the second open ends of, the loop elbows.

Abstract: A language construct that allows a software programmer to use an intermediate or high-level language command to explicitly group operations or fuse loops in a group of statements operating on parallel arrays is disclosed. The command instructs a compiler, which would otherwise add temporary variables to avoid data dependencies or perform data dependency analysis, to translate the enclosed statements directly into machine language code without adding those temporary variables and without performing any data dependency analysis. Execution of the command results in the performance of the group of statements by all of the virtual processors.

Abstract: Postponing the interrupt for an I/O event can increase system throughput by amortizing the cost of the interrupt service routine over multiple I/O events. In current systems that provide interrupt postponement, the time parameter is fixed. Fixed values can lead to parameter configuration errors, excessive characterization work to generate parameter values, and a failure to automatically re-configure to system changes or to external load changes. The proposed mechanism measures actual system experience and eliminates the parameter configuration effort by filtering its own experience to derive a target value for interrupt postponement. A current postponement value with the potentially greater variance than the target is used to rapidly respond to abrupt change in offered load. The invention also benefits tasks with real-time deadlines to provide correct system operation.

Abstract: Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the housing for polishing a second face of the semiconductor wafer. The second face of the semiconductor wafer is opposite the first face of the semiconductor wafer. A first transfer mechanism is within the housing for delivering the polishing block and semiconductor wafer from the mounting apparatus to adjacent the first semiconductor wafer polisher. A controller controls operation of the mounting apparatus, the first semiconductor wafer polisher, and the first transfer mechanism.

Abstract: In the present invention, one of the bits in the tag value in the cache is hard-wired, for example, to 0, at such a position in the cache that that bit is always set to 0 when a tag is stored in the cache (or forced to 0 when a tag is read from the cache). Instructions executed by the processor can specify a read outside the cache, i.e. of the most recent data written to the main memory by some DMA agent, by specifying a read address with the designated bit equal to one. In this way, a cache miss is forced, allowing the processor to read the most recent data from the main memory of the system and to cache the data. As the cache is refilled from the main memory, the hard-wired tag bit of course remains set to zero. So later processor instructions that read data within the same cache refill block would use the normal address of that data (having the designated bit set to zero). These subsequent reads will not force a cache miss.

Abstract: In an interactive video-on-demand system, real-time programs are encoded as a transport stream including a plurality of transport stream packets. Some of the transport stream packets include timing signals indicating the real time of the program. The transport stream packets are formatted into transport cells for transport over an asynchronous transfer mode network from a source to a destination. The cells are transported at a transport rate which is determined by a network clock. The transport rate is chosen to deliver the transport stream faster than the real time of the program. While transporting the transport stream, it is determined if the transport stream is being transported ahead of the real time of the program. In this case, idle cells are injected into the transport stream to have the program arrive at the destination in the real time of the program.

Abstract: A wafer workpiece polishing temperature control method and apparatus are provided wherein wafers are mounted upon a rotatable pressure plate assembly positioned in rotatable contact with a turntable assembly supported polishing pad, the turntable assembly having internal fluid cooling means, the wafer polishing temperature control being achieved through responsive closed loop electromechanical means activated by variation of polishing pressure upon the wafers and the polishing pad.

Abstract: Apparatus and method for wax mounting of thin wafers such as slices of semiconductor silicon to a carrier for polishing wherein the carrier is heated after being coated with wax which is maintained in a sticky condition by the heated carrier. A chamber is utilized for enclosing the thin wafers on resilient supports with the sticky wax-coated, heated carrier disposed above them. The chamber has an air tight seal permitting it to be evacuated. After evacuation a pneumatic cylinder is utilized to press the carrier against the wafers, which adhere to the sticky wax coating. The chamber is vented then to atmospheric pressure, the wafers remaining mounted by the wax coating to the carrier for subsequent polishing. The method avoids entrapment of gas bubbles between wafers and carrier.

Abstract: Apparatus for improving polished wafer flatness such as slices of semiconductor materials through mounting of the wafers onto a deformable thin disc carrier which is mounted through a resilient device to a rotable pressure plate, the combined mounting being rotably engageable with a rotable turntable supported polishing surface, the turntable having an axis of rotation to edge bow away from the mounted wafers. The carrier is deformed to a concave shape opening toward the bowed table; thus permitting the mounted wafers to achieve through rotation polishing, uniformly improved flatness.

Abstract: Method for combined chemical-mechanical polishing of III - V semiconductor planar surfaces by applying a weak aqueous hydrochloric acid solution in combination with an aqueous source of chlorine to the surface to be polished while simultaneously mechanically polishing the surface.

Abstract: Circular wafers of semiconductor (silicon) are chemically treated, e.g., etched, by supporting the wafers vertically by contacting their edges with annularly grooved drive rollers, immersing the supported wafers in a body of chemical medium (e.g., etchant solution) for treatment, and rotating the wafers by rotation of the drive rollers while the wafers are immersed in the body of medium to uniformly and precisely treat the surfaces of the wafers. Apparatus for effecting such precision etching includes an etchant tank, a wafer rack including the drive rollers which support the edges of the wafers in vertical face-to-face relationship, the rack being lowered into the etchant to immerse the wafers. Means is disclosed for rotating the drive rollers for rotation of the immersed wafers and provision is included for circulating the etchant for causing uniform flow thereof past the rotating wafers. A heat exchanger maintains the etchant substantially at a predetermined temperature.