Abstract: An apparatus and method for registration or alignment of thin film structure patterns on a substrate formed with the use of an apertured mask in a vacuum deposition system. On particular the alignment apparatus is comprised of a mask holder assembly, which supports the apertured mask, and a substrate carrier which engages with the holder assembly. Upon placing the engaged alignment apparatus in a a deposition chamber, a magnet is positioned adjacent the holder assembly in order to formly hold the apertured mask against a substrate prior to vacuum to deposition. Upon depositing the pattern material, the magnet and holder assembly are disengaged, resulting in a pattern of thin film structures remaining on the substrate. The present invention is effective for remotely operating automatic masking systems where there is a need to eliminate the need for breaking vacuum in a deposition system.

Abstract: A method of aligning thin-film structure patterns on a substrate formed with the use of an apertured mask in a vacuum deposition system.