Abstract: A transmission line connector for a contact set assembly for making contacts to contact elements of electrical devices, such as IC devices including DIPs and LCCs, affords a controlled impedance path between the contact elements of a device to be contacted and remote terminal ends of the respective transmission line conductors. The connector may be flexible or rigid. An actuating mechanism engages the connector adjacent the opposite end edges thereof for urging probe elements attached to the respective end terminals of the respective plurality of conductive lines into engagement with corresponding contact elements of the device to be contacted. A flexible transmission line connector permits rapid and continuous actuation of the actuating device between a normal disengaged position and an engaged position for making contact. The controlled impedance transmission line conductor is adaptable for providing contact to a wide range of device as to size and configuration, and as to number and location of contacts.

Abstract: A handler (10) for feeding integrated circuit chip carriers (42) into a test site (14) of the handler (10) is the subject matter of this patent application. Inventive features include apparatus whereby carriers (42) are pushed laterally from a bottom end (62) of a magazine track (26) into a conveyor station (58). A pusher bar (64) can include a ramp surface (128) to raise carriers (42) above the particular carrier (42) being moved into the conveyor station (58). Further, the inventive features include structure for remotely sensing the presence of a carrier (42) at the bottom end (62) of a track (26). A rotary shuttle (148) can be incorporated for transporting carriers (42), after they have been tested, to the output section (158) of the handler (10).

Abstract: An air bearing and heating system for use in moving and heating integrated circuit chip carriers (12) prior to their being tested by an electronic tester (10) is the subject of this patent application. The system includes a magazine (18) having a plurality of tracks (24) spaced vertically therein. Each track (24) includes an air-permeable wall (62, 62') through which air in a plenum (52) beneath the wall (62, 62') seeps. The air forms a cushion on the surfaces (64) of the sloped tracks (24) in order to float chip carriers (12), positioned for movement down the tracks (24) therealong.The air can be heated by a heater (104) prior to the time it is introduced to form the air cushion so that the chip carriers (12) will be heated as they are floated down the tracks (24).Similarly, the system can be provided with a distribution member (28) by which carriers (12) are conveyed away from the test site (14) of the handler.