Patents by Inventor Robert James Bogert

Robert James Bogert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11017939
    Abstract: Magnetic component assemblies for circuit boards include magnetic cores formed with a gap and preformed conductive windings sliding assembled to the cores via the gaps. The gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: May 25, 2021
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Ahila Krishnamoorthy, Robert James Bogert, Yipeng Yan
  • Patent number: 10020110
    Abstract: A surface mount power inductor component for a circuit board includes a magnetic body, at least one conductive coil, and surface mount terminations for completing an electrical connection between the conductive coil and the circuit board. One of the body and the surface mount terminations is configured to accommodate a separately provided component in a vertically stacked relation with the separately provided circuit board component being located between the circuit board and the body.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: July 10, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Renford Hanley, Guo Ouyang, Dengyan Zhou, Robert James Bogert, Yipeng Yan
  • Patent number: 9978508
    Abstract: A surface mount swing-type inductor component is configured to establish a non-uniform gap when assembled. The non-uniform gap produces swing-type inductor functionality in a compact package for higher current applications while being manufacturable at relatively low cost.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: May 22, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Yipeng Yan, Robert James Bogert
  • Patent number: 9870856
    Abstract: Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: January 16, 2018
    Assignee: COOPER TECHNOLOGIES COMPANY
    Inventors: Ahila Krishnamoorthy, Robert James Bogert, Yipeng Yan
  • Patent number: 9859043
    Abstract: Magnetic component assemblies including moldable magnetic materials formed into magnetic bodies, at least one conductive coil, and termination features are disclosed that are advantageously utilized in providing surface mount magnetic components such as inductors and transformers.
    Type: Grant
    Filed: April 22, 2010
    Date of Patent: January 2, 2018
    Assignee: COOPER TECHNOLOGIES COMPANY
    Inventors: Yipeng Yan, Robert James Bogert
  • Patent number: 9558881
    Abstract: A surface mount power inductor includes a preformed conductive winding clip and first and second-shaped core pieces. The core pieces may be configured to reduce unbalanced force experienced in the power inductor in certain types of power management circuitry. Reduction in the unbalanced force reduces vibration of the power inductor in use, and in turn reduces acoustic noise as the power inductor operates.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: January 31, 2017
    Assignee: COOPER TECHNOLOGIES COMPANY
    Inventors: Zhuomin Liu, Robert James Bogert
  • Publication number: 20160276087
    Abstract: A surface mount swing-type inductor component is configured to establish a non-uniform gap when assembled. The non-uniform gap produces swing-type inductor functionality in a compact package for higher current applications while being manufacturable at relatively low cost.
    Type: Application
    Filed: February 26, 2016
    Publication date: September 22, 2016
    Inventors: Yipeng Yan, Robert James Bogert
  • Publication number: 20160260536
    Abstract: A surface mount power inductor component for a circuit board includes a magnetic body, at least one conductive coil, and surface mount terminations for completing an electrical connection between the conductive coil and the circuit board. One of the body and the surface mount terminations is configured to accommodate a separately provided component in a vertically stacked relation with the separately provided circuit board component being located between the circuit board and the body.
    Type: Application
    Filed: May 16, 2016
    Publication date: September 8, 2016
    Inventors: Renford Hanley, Guo Ouyang, Dengyan Zhou, Robert James Bogert, Yipeng Yan
  • Patent number: 9275787
    Abstract: Magnetic components including pre-formed clips are described that are more amenable to production on a miniaturized scale. Discrete core pieces can be assembled with pre-formed coils and physically gapped from one another with more efficient manufacturing techniques.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: March 1, 2016
    Assignee: COOPER TECHNOLOGIES COMPANY
    Inventors: Yipeng Yan, Robert James Bogert, Guo Ouyang, Zhigang Cheng
  • Publication number: 20160005528
    Abstract: An electromagnet component assembly includes a preformed conductive winding formed in at least first and second pieces for assembly with a single magnetic core with a simplified and relatively low cost manufacture. The assembly provides a power inductor operable at higher current, higher power levels with reduced direct current resistance.
    Type: Application
    Filed: September 15, 2015
    Publication date: January 7, 2016
    Inventors: Yipeng Yan, Robert James Bogert, Brent Elliot, Guo Ouyang
  • Patent number: 9202617
    Abstract: A low profile surface mount electromagnetic component such as a power inductor includes first and second core pieces arranged side by side and having longitudinal side walls facing one another. A preformed coil winding includes vertical legs that are received in vertical slots of the facing longitudinal sidewalls of the component. Inset depressed sections are provided in the top surfaces of the first and second magnetic core pieces and receive a main winding section of the coil winding. Surface mount terminal tabs extend on the bottom surfaces of both the first and second magnetic core pieces.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: December 1, 2015
    Assignee: COOPER TECHNOLOGIES COMPANY
    Inventors: Dengyan Zhou, Yipeng Yan, Robert James Bogert, Brent Alan Elliott
  • Patent number: 8941457
    Abstract: Magnetic components such as power inductors for circuit board applications include pressure laminate constructions involving flexible dielectric sheets that may integrally include magnetic powder materials. The dielectric sheets may be pressure laminated around a coil winding in an economical and reliable manner, with performance advantages over known magnetic component constructions.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: January 27, 2015
    Assignee: Cooper Technologies Company
    Inventors: Yipeng Yan, Robert James Bogert, Daniel Minas Manoukian
  • Publication number: 20150009004
    Abstract: A low profile surface mount electromagnetic component such as a power inductor includes first and second core pieces arranged side by side and having longitudinal side walls facing one another. A preformed coil winding includes vertical legs that are received in vertical slots of the facing longitudinal sidewalls of the component. Inset depressed sections are provided in the top surfaces of the first and second magnetic core pieces and receive a main winding section of the coil winding. Surface mount terminal tabs extend on the bottom surfaces of both the first and second magnetic core pieces.
    Type: Application
    Filed: June 25, 2014
    Publication date: January 8, 2015
    Inventors: Dengyan Zhou, Yipeng Yan, Robert James Bogert, Brent Alan Elliott
  • Patent number: 8910373
    Abstract: A method for manufacturing a low profile, magnetic component. The method includes stacking a the plurality of substantially planar and flexible magnetic powder sheets, locating a preformed multiple turn conductive winding between at least two of the plurality of substantially planar and flexible magnetic powder sheets in the stack, and pressure laminating the flexible magnetic powder sheets around the preformed multiple turn conductive winding to define a magnetic core containing the winding.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: December 16, 2014
    Assignee: Cooper Technologies Company
    Inventors: Yipeng Yan, Robert James Bogert
  • Publication number: 20140313003
    Abstract: A surface mount power inductor includes a preformed conductive winding clip and first and second-shaped core pieces. The core pieces may be configured to reduce unbalanced force experienced in the power inductor in certain types of power management circuitry. Reduction in the unbalanced force reduces vibration of the power inductor in use, and in turn reduces acoustic noise as the power inductor operates.
    Type: Application
    Filed: March 18, 2014
    Publication date: October 23, 2014
    Inventors: Zhuomin Liu, Robert James Bogert
  • Publication number: 20140266555
    Abstract: Magnetic component assemblies for circuit boards include magnetic cores formed with a gap and preformed conductive windings sliding assembled to the cores via the gaps. The gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.
    Type: Application
    Filed: January 3, 2014
    Publication date: September 18, 2014
    Inventors: Ahila Krishnamoorthy, Robert James Bogert, Yipeng Yan
  • Publication number: 20140266539
    Abstract: Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.
    Type: Application
    Filed: January 3, 2014
    Publication date: September 18, 2014
    Inventors: Ahila Krishnamoorthy, Robert James Bogert, Yipeng Yan
  • Patent number: 8659379
    Abstract: Magnetic component assemblies including coil coupling arrangements, that are advantageously utilized in providing surface mount magnetic components such as inductors and transformers.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: February 25, 2014
    Assignee: Cooper Technologies Company
    Inventors: Yipeng Yan, Robert James Bogert
  • Patent number: 8484829
    Abstract: Methods of manufacturing low profile magnetic components configured as a power management devices for an electrical system of an electronic device involve prefabricated coil windings assembled with a plurality of flexible dielectric sheet layers, and laminating the plurality of flexible dielectric sheets around the prefabricated coil windings to form a dielectric body having a low profile chip configuration attachable to the electronic device.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: July 16, 2013
    Assignee: Cooper Technologies Company
    Inventors: Daniel Minas Manoukian, Robert James Bogert
  • Patent number: 8466764
    Abstract: A low profile magnetic component includes at least one coil layer defining a generally planar coil winding having a center area and a number of turns extending about the center area. A body encloses the coil layer, and is fabricated from one of a dielectric material and a magnetic material. A magnetic core material occupies at least the center area of the coil layer.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: June 18, 2013
    Assignee: Cooper Technologies Company
    Inventors: Robert James Bogert, Yipeng Yan, Frank Anthony Doljack, Hundi Panduranga Kamath