Patents by Inventor Robert Jan Van Wijk
Robert Jan Van Wijk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11520238Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.Type: GrantFiled: September 20, 2021Date of Patent: December 6, 2022Assignee: ASML Netherlands B.V.Inventors: Jelle Nije, Alexander Ypma, Dimitra Gkorou, Georgios Tsirogiannis, Robert Jan Van Wijk, Tzu-Chao Chen, Frans Reinier Spiering, Sarathi Roy, Cédric Désiré Grouwstra
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Publication number: 20220004108Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.Type: ApplicationFiled: September 20, 2021Publication date: January 6, 2022Applicant: ASML NETHERLANDS B.V.Inventors: Jelle NIJE, Alexander YPMA, Dimitra GKOROU, Georgios TSIROGIANNIS, Robert Jan VAN WIJK, Tzu-Chao CHEN, Frans Reinier SPIERING, Sarathi ROY, Cédric Désiré GROUWSTRA
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Patent number: 11150562Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.Type: GrantFiled: February 22, 2018Date of Patent: October 19, 2021Assignee: ASML Netherlands B.V.Inventors: Jelle Nije, Alexander Ypma, Dimitra Gkorou, Georgios Tsirogiannis, Robert Jan Van Wijk, Tzu-Chao Chen, Frans Reinier Spiering, Sarathi Roy, Cédric Désiré Grouwstra
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Patent number: 11099485Abstract: A method of maintaining a set of fingerprints representing variation of one or more process parameters across wafers subjected to a device manufacturing method, the method including: receiving measurement data of one or more parameters measured on wafers; updating the set of fingerprints based on an expected evolution of the one or more process parameters; and evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence, and the decomposition may involve: estimating, based the received measurement data, likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.Type: GrantFiled: April 9, 2018Date of Patent: August 24, 2021Assignee: ASML Netherlands B.V.Inventors: Alexander Ypma, Vahid Bastani, Dag Sonntag, Jelle Nije, Hakki Ergün Cekli, Georgios Tsirogiannis, Robert Jan Van Wijk
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Publication number: 20210157247Abstract: A method of maintaining a set of fingerprints representing variation of one or more process parameters across wafers subjected to a device manufacturing method, the method including: receiving measurement data of one or more parameters measured on wafers; updating the set of fingerprints based on an expected evolution of the one or more process parameters; and evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence, and the decomposition may involve: estimating, based the received measurement data, likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.Type: ApplicationFiled: April 9, 2018Publication date: May 27, 2021Applicant: ASML NETHERLANDS B.VInventors: Alexander YPMA, Vahid BASTANI, Dag SONNTAG, Jelle NIJE, Hakki Ergün CEKLI, Georgios TSIROGIANNIS, Robert Jan VAN WIJK
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Publication number: 20200233315Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.Type: ApplicationFiled: February 22, 2018Publication date: July 23, 2020Applicant: ASML NETHERLANDS B.V.Inventors: Jelle NIJE, Alexander YPMA, Dimitra GKOROU, Georgios TSIROGIANNIS, Robert Jan VAN WIJK, Tzu-Chao CHEN, Frans Reinier SPIERING, Sarathi ROY, Cédric Désiré GROUWSTRA
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Patent number: 7148494Abstract: The invention relates to a level sensor for use in a lithographic apparatus that determines a surface height of a substrate. The level sensor includes an emitter and a receiver, wherein the emitter is arranged to emit a signal directed to a predetermined position on the surface of the substrate, such that the signal is at least partially reflected by the substrate to render a reflected signal. The receiver is arranged to receive at least part of the reflected signal, and the level sensor is arranged to determine the surface height of the substrate with respect to the level sensor based on the emitted and received signal. The signal includes a pressure wave.Type: GrantFiled: December 29, 2004Date of Patent: December 12, 2006Assignee: ASML Netherlands B.V.Inventors: Anastasius Jacobus Anicetus Bruinsma, Frank Staals, Robert Jan Van Wijk, Stoyan Nihtianov
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Patent number: 6987555Abstract: According to one embodiment, a method of calibrating level sensors of at least two lithographic projection apparatus to correct machine to machine level sensor process dependency includes using a first lithographic projection apparatus to measure a first set of leveling data for a reference substrate and a second set of leveling data for a substrate processed according to a selected process, and using a second lithographic projection apparatus to measure a third set of leveling data for the reference substrate and a fourth set of leveling data for the processed substrate. The method also includes calculating, based on the first, second, third and fourth sets of leveling data, a set of level sensor parameters corresponding to machine to machine level sensor differences for the selected process, wherein the machine to machine level sensor differences are measured and stored as intrafield values.Type: GrantFiled: July 16, 2004Date of Patent: January 17, 2006Assignee: ASML Netherlands B.V.Inventors: Paulus Antonius Andreas Teunissen, Gerrit Johannes Nijmeijer, Rene Marinus Gerardus Johan Queens, Frank Staals, Robert Jan Van Wijk, Roeland Nicolaas Maria Vanneer
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Patent number: 6423262Abstract: The invention pertains to a technique for determining the dye uptake or measuring one or more structural parameters or mechanical properties of polymeric fibres. This technique entails measuring the Raman spectrum of the fibres during or after a spinning process. After the Raman spectrum has been treated, a model is applied to it which is derived from the Raman spectra of fibres having the same chemical composition as the fibres to be examined.Type: GrantFiled: May 1, 2000Date of Patent: July 23, 2002Assignee: Akzo Nobel N.V.Inventors: Robert Jan Van Wijk, Anton Peter De Weijer, Dirk Albert Klarenberg, Roel De Jonge, Gert Jan Jongerden