Abstract: A leak detection system includes a substrate with a plurality of high-voltage contact and a plurality of low-voltage contacts positioned on the substrate. The plurality of low-voltage contacts is positioned on the substrate wherein a closest contact to each of the low-voltage contacts is a high-voltage contact. The plurality of high-voltage contact and the plurality of low-voltage contacts are electrically coupled to a logic device, which measures any change in current across at least one of the plurality of high-voltage contacts and at least one of the plurality of low-voltage contacts to detect a fluid leak in contact with the leak detection system.

Abstract: A computer system with thermal management includes a boiler tank and a first computer component on a substrate in the boiler tank. A cooling fluid is positioned in the boiler tank and covering the first computer component. The boiler tank has a length, width, and height where the length and width of the boiler tank define a tank area that is no more than 50% larger than the substrate area.

Abstract: A device for simulating thermal loads includes a platform and a plurality of nodes supported by the platform. At least one node is a movable node connected to the platform by a movable stage to move the movable node relative to the platform.

Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.

Abstract: A quick disconnect system includes a housing and a first connector of a quick disconnect configured to complementarily mate with a second connector of the quick disconnect. A pre-loaded biasing element is configured to provide a biasing force between the first connector and the housing. A method for mating a quick disconnect is also described. The method includes receiving a connecting force to mate a first connector of a quick disconnect in a housing with a second connector of the quick disconnect. When the connecting force is at least equal to or greater than a mating force value, the first connector is mated with the second connector. When the connecting force is greater than a pre-load value of a biasing element in the housing, the mated quick disconnect is moved relative to the housing while maintaining the connection of the mated quick disconnect.

Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.

Abstract: Techniques for controlling cooling of electronic components in computing facilities are disclosed herein. In one embodiment, a method includes detecting a pressure drop of a coolant flowing across multiple servers in an enclosure between the inlet and outlet manifolds and a supply temperature of the coolant at the inlet manifold. The method further includes automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint.

Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.

Abstract: Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade.

Abstract: A system includes a battery, a thermally-conductive element in thermal communication with the battery, a housing defining an internal volume, the internal volume including the battery and a first end of the thermally-conductive element, and a heat dissipation unit disposed outside of the internal volume, where a second end of the thermally-conductive element is disposed outside of the internal volume and is in thermal communication with the heat dissipation unit.