Patents by Inventor Robert Jason LANKSTON, II

Robert Jason LANKSTON, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240019334
    Abstract: A leak detection system includes a substrate with a plurality of high-voltage contact and a plurality of low-voltage contacts positioned on the substrate. The plurality of low-voltage contacts is positioned on the substrate wherein a closest contact to each of the low-voltage contacts is a high-voltage contact. The plurality of high-voltage contact and the plurality of low-voltage contacts are electrically coupled to a logic device, which measures any change in current across at least one of the plurality of high-voltage contacts and at least one of the plurality of low-voltage contacts to detect a fluid leak in contact with the leak detection system.
    Type: Application
    Filed: October 29, 2021
    Publication date: January 18, 2024
    Inventors: David William MAYER, Fenghua SHEN, Chadd Nathaniel GARTON, Robert Jason LANKSTON, II
  • Publication number: 20230152369
    Abstract: A device for simulating thermal loads includes a platform and a plurality of nodes supported by the platform. At least one node is a movable node connected to the platform by a movable stage to move the movable node relative to the platform.
    Type: Application
    Filed: November 18, 2021
    Publication date: May 18, 2023
    Inventors: Dennis TRIEU, Bharath RAMAKRISHNAN, Husam Atallah ALISSA, Robert Jason LANKSTON, II, Xudong TANG
  • Publication number: 20220412493
    Abstract: A quick disconnect system includes a housing and a first connector of a quick disconnect configured to complementarily mate with a second connector of the quick disconnect. A pre-loaded biasing element is configured to provide a biasing force between the first connector and the housing. A method for mating a quick disconnect is also described. The method includes receiving a connecting force to mate a first connector of a quick disconnect in a housing with a second connector of the quick disconnect. When the connecting force is at least equal to or greater than a mating force value, the first connector is mated with the second connector. When the connecting force is greater than a pre-load value of a biasing element in the housing, the mated quick disconnect is moved relative to the housing while maintaining the connection of the mated quick disconnect.
    Type: Application
    Filed: June 28, 2021
    Publication date: December 29, 2022
    Inventors: Chadd Nathaniel GARTON, David William MAYER, Martha Geoghegan PETERSON, Robert Jason LANKSTON, II, Xudong TANG
  • Publication number: 20220201902
    Abstract: Techniques for controlling cooling of electronic components in computing facilities are disclosed herein. In one embodiment, a method includes detecting a pressure drop of a coolant flowing across multiple servers in an enclosure between the inlet and outlet manifolds and a supply temperature of the coolant at the inlet manifold. The method further includes automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: Mark Edward Shaw, Husam Atallah Alissa, Brandon Rubenstein, Robert Jason Lankston, II, Christian Belady, Bharath Ramakrishnan
  • Publication number: 20190363410
    Abstract: A system includes a battery, a thermally-conductive element in thermal communication with the battery, a housing defining an internal volume, the internal volume including the battery and a first end of the thermally-conductive element, and a heat dissipation unit disposed outside of the internal volume, where a second end of the thermally-conductive element is disposed outside of the internal volume and is in thermal communication with the heat dissipation unit.
    Type: Application
    Filed: May 25, 2018
    Publication date: November 28, 2019
    Inventors: John Joseph SIEGLER, Shaun L. HARRIS, Robert Jason LANKSTON, II, Brandon Aaron RUBENSTEIN, Michael Geoffrey TRICKER