Patents by Inventor Robert Jecmen

Robert Jecmen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface planarization method for VLSI technology
    Patent number: 4775550
    Abstract: A planarization process for a double metal very large scale integration (VLSI) technology is disclosed. To compensate for an irregular surface topology encountered in a dielectric medium between the two metals, a CVD dielectric layer and a glass layer are first deposited above the first metal. Then an etch-back process is used to uniformly etch back the CVD dielectric and the glass layers at the same rate, leaving a planarized surface for subsequent deposition of a second dielectric layer and a second metal layer.
    Type: Grant
    Filed: June 3, 1986
    Date of Patent: October 4, 1988
    Assignee: Intel Corporation
    Inventors: John K. Chu, Sanjiv K. Mittal, John T. Orton, Jagir S. Multani, Robert Jecmen