Abstract: A shipping kit assembly is disclosed for use in transporting circuit packs installed in electronic bays. The assembly kit includes a pair of spaced, upper and lower channel members which, together with a vertical band strap received in and retained thereby, are adapted to secure and support a plurality of circuit packs which are installed in shelf units or sub-racks for shipping or transporting therein. The bottom channel member incorporates a supporting bracket at each end therefor for securing and locating an attached circuit pack in a predetermined location in the shelf unit or sub-rack. One or more horizontal band straps may be used to secure the packs against movement in the shelf unit.