Patents by Inventor Robert John Blemberg

Robert John Blemberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090297814
    Abstract: A multilayer film comprising, a cross-linked ethylene copolymer layer such as ethylene vinyl acetate layer, an HDPE layer, and a sealant layer, for use, for example, to form a package for dry food products. The multilayer film has a thickness of less than about 2.0 mils, such as between 1-1.5 mils and a tear strength in the machine direction of greater than 40 grams.
    Type: Application
    Filed: May 28, 2009
    Publication date: December 3, 2009
    Inventors: Kevin J. Curie, Robert John Blemberg
  • Patent number: 6638461
    Abstract: The present invention discloses an extrusion die module having a flat compression seal and a conical or otherwise angled spillover surface. The die module promotes a flat surface to flat surface compression seal outside of the flow distribution channels and promotes better streamlined flow and material combination than a traditional flat disk die module. The die module promotes a reduced overall diameter and wetted diameter in comparison to standard flat disk dies. Further, the present invention relates to a method for utilizing an extrusion die module with a conical or otherwise angled spillover surface to minimize the die surface area wetted by an intermediate layer in a multi-layer coextrusion process.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: October 28, 2003
    Assignee: Pechiney Emballage Flexible Europe
    Inventors: Randolph L. Davidson, Robert John Blemberg
  • Patent number: 6638463
    Abstract: The present invention discloses an extrusion die module having a flat compression seal surrounding a conical or otherwise angled spillover surface. The die module promotes a flat surface to flat surface compression seal outside of the flow distribution channels and promotes better streamlined flow and material combination than a traditional flat disk die module. The die module promotes a reduced overall diameter and wetted diameter in comparison to standard flat disk dies. In addition, the conical or angled spillover surface is surrounded by the planar sealing surface. Further, the present invention relates to a method for utilizing an extrusion die module with a conical or otherwise angled spillover surface to minimize the die surface area wetted by an intermediate layer in a multi-layer coextrusion process.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: October 28, 2003
    Assignee: Pechiney Emballage Flexible Europe
    Inventors: Randolph L. Davidson, Robert John Blemberg
  • Patent number: 6638462
    Abstract: The present invention relates to an extrusion die assembly. Specifically, the present invention relates to an extrusion die assembly comprising a pair of extrusion dies wherein one extrusion die is disposed within the second extrusion die. The extrusion dies may comprise a plurality of extrusion die modules wherein at least one of the extrusion die modules incorporates a flat compression deal with a conical or otherwise angled spillover surface. Further, the present invention relates to a method for utilizing an extrusion die assembly comprising a pair of extrusion dies, each having at least one extrusion die module having a conical or otherwise angled spillover surface.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: October 28, 2003
    Assignee: Pechiney Emballage Flexible Europe
    Inventors: Randolph L. Davidson, Robert John Blemberg
  • Patent number: 6638464
    Abstract: The present invention discloses an extrusion die module having a flat compression seal surrounded by a conical or otherwise angled spillover surface. The die module promotes a flat surface to flat surface compression seal outside of the flow distribution channels and promotes better streamlined flow and material combination than a traditional flat disk die module. The die module promotes a reduced overall diameter and wetted diameter in comparison to standard flat disk dies. In addition, the present invention relates to an extrusion die module having a spillover surface surrounding a planar sealing surface. Further, the present invention relates to a method for utilizing an extrusion die module with a conical or otherwise angled spillover surface to minimize the die surface area wetted by an intermediate layer in a multi-layer coextrusion process.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: October 28, 2003
    Assignee: Pechiney Emballage Flexible Europe
    Inventors: Randolph L. Davidson, Robert John Blemberg
  • Publication number: 20030020203
    Abstract: The present invention discloses an extrusion die module having a flat compression seal and a conical or otherwise angled spillover surface. The die module promotes a flat surface to flat surface compression seal outside of the flow distribution channels and promotes better streamlined flow and material combination than a traditional flat disk die module. The die module promotes a reduced overall diameter and wetted diameter in comparison to standard flat disk dies. Further, the present invention relates to a method for utilizing an extrusion die module with a conical or otherwise angled spillover surface to minimize the die surface area wetted by an intermediate layer in a multi-layer coextrusion process.
    Type: Application
    Filed: July 27, 2001
    Publication date: January 30, 2003
    Inventors: Randolph L. Davidson, Robert John Blemberg
  • Publication number: 20030020205
    Abstract: The present invention discloses an extrusion die module having a flat compression seal surrounding a conical or otherwise angled spillover surface. The die module promotes a flat surface to flat surface compression seal outside of the flow distribution channels and promotes better streamlined flow and material combination than a traditional flat disk die module. The die module promotes a reduced overall diameter and wetted diameter in comparison to standard flat disk dies. In addition, the conical or angled spillover surface is surrounded by the planar sealing surface. Further, the present invention relates to a method for utilizing an extrusion die module with a conical or otherwise angled spillover surface to minimize the die surface area wetted by an intermediate layer in a multi-layer coextrusion process.
    Type: Application
    Filed: July 27, 2001
    Publication date: January 30, 2003
    Inventors: Randolph L. Davidson, Robert John Blemberg
  • Publication number: 20030020204
    Abstract: The present invention relates to an extrusion die assembly. Specifically, the present invention relates to an extrusion die assembly comprising a pair of extrusion dies wherein one extrusion die is disposed within the second extrusion die. The extrusion dies may comprise a plurality of extrusion die modules wherein at least one of the extrusion die modules incorporates a flat compression deal with a conical or otherwise angled spillover surface. Further, the present invention relates to a method for utilizing an extrusion die assembly comprising a pair of extrusion dies, each having at least one extrusion die module having a conical or otherwise angled spillover surface.
    Type: Application
    Filed: July 27, 2001
    Publication date: January 30, 2003
    Inventors: Randolph L. Davidson, Robert John Blemberg
  • Publication number: 20030020206
    Abstract: The present invention discloses an extrusion die module having a flat compression seal surrounded by a conical or otherwise angled spillover surface. The die module promotes a flat surface to flat surface compression seal outside of the flow distribution channels and promotes better streamlined flow and material combination than a traditional flat disk die module. The die module promotes a reduced overall diameter and wetted diameter in comparison to standard flat disk dies. In addition, the present invention relates to an extrusion die module having a spillover surface surrounding a planar sealing surface. Further, the present invention relates to a method for utilizing an extrusion die module with a conical or otherwise angled spillover surface to minimize the die surface area wetted by an intermediate layer in a multi-layer coextrusion process.
    Type: Application
    Filed: July 27, 2001
    Publication date: January 30, 2003
    Inventors: Randolph L. Davidson, Robert John Blemberg
  • Patent number: 5705111
    Abstract: Methods related to coextrusion of heat-sensitive polymer materials. The sensitive melt stream element (12) is encapsulated in a second polymeric melt stream element (16). Transport means (36) is preferably employed between the encapsulating means (20) and the die (42). A third melt stream element (68) is joined to one or both opposing surfaces (70) of the second melt stream element (16) between the encapsulating means (20) and the die (42). In the die (42) the encapsulated melt stream element (12) becomes an interior layer (46) between encapsulating layers (48A, 48B) derived from the second melt stream element (16). The third melt stream element (68) forms layers (72, 74) positioned outwardly of the encapsulating layers (48A, 48B). The positioning, on the interior of the extrudate, of edges (54) of layer (46) is adjusted independently of the combined thicknesses of a layer derived from the third melt stream element (68) and an adjacent layer (48).
    Type: Grant
    Filed: January 20, 1995
    Date of Patent: January 6, 1998
    Assignee: American National Can Company
    Inventors: Robert John Blemberg, John P. Eckstein, Kevin J. Curie